Title:
ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/043066
Kind Code:
A1
Abstract:
Provided are an anisotropic conductive adhesive with which interference with cationic polymerization reaction is inhibited and good connection is possible, and a method for producing a connection structure. The anisotropic conductive adhesive comprises a cationic polymerizable compound, a cationic polymerization initiator, a metal chelate compound, and conductive particles. As a result, the metal chelate compound reacts with basic hydroxyl groups and therefore, interference with cationic polymerization reaction is inhibited and a good connection can be obtained.
Inventors:
MATSUSHIMA TAKAYUKI (JP)
Application Number:
PCT/JP2015/075221
Publication Date:
March 24, 2016
Filing Date:
September 04, 2015
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J201/00; C09J5/00; C09J7/00; C09J9/02; C09J11/02; G06F3/041; H01R11/01
Domestic Patent References:
| WO2008090719A1 | 2008-07-31 | |||
| WO2008090792A1 | 2008-07-31 | |||
| WO2012111365A1 | 2012-08-23 | |||
| WO2013027541A1 | 2013-02-28 |
Foreign References:
| JP2003292921A | 2003-10-15 | |||
| JP2002212537A | 2002-07-31 | |||
| JP2009019077A | 2009-01-29 |
Attorney, Agent or Firm:
NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)
Nobuhiro Noguchi (JP)
Download PDF: