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Patent Searching and Data


Title:
ANISOTROPIC CONDUCTIVE FILM, CONNECTION METHOD, AND ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2014/045931
Kind Code:
A1
Abstract:
An anisotropic conductive film in which a terminal of first electronic component and a terminal of second electronic component are connected in an anisotropically conductive manner; wherein the anisotropic conductive film contains a crystalline resin, and amorphous resin, and conductive particles; and the crystalline resin has a resin-characterizing bond that is the same as the resin-characterizing bond of the non-crystalline resin.

Inventors:
YAMADA YASUNOBU (JP)
UESAWA NAOYA (JP)
AOKI KAZUHISA (JP)
Application Number:
PCT/JP2013/074317
Publication Date:
March 27, 2014
Filing Date:
September 10, 2013
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R11/01; C08J5/18; C09J7/00; C09J9/02; C09J11/04; C09J121/00; C09J167/00; C09J201/00; H01B5/16; H01R43/00
Domestic Patent References:
WO2009038190A12009-03-26
WO1999001519A11999-01-14
Foreign References:
JP2005190933A2005-07-14
JP2011132304A2011-07-07
Other References:
See also references of EP 2884590A4
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
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