Title:
ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/071271
Kind Code:
A1
Abstract:
This anisotropic conductive film is suitable for anisotropic conductive connection to a flexible plastic substrate on which are formed an electronic component having a bump, such as an image display element or an IC chip for driving, and a transparent electrode and wiring, the film having at least a conductive particle dispersion layer formed from an insulating resin layer and conductive particles dispersed therein. This anisotropic conductive film satisfies the following conditions. Condition (A): The modulus of elasticity of the conductive particles at 20% compression is 6000-15000 N/mm2. Condition (B): The compression recovery rate of the conductive particles is 40-80%. Condition (C): The average particle diameter of the conductive particles is 1-30 μm. Condition (D): The minimum melt viscosity of the insulating resin layer is 4000 Pa∙s or less. Condition (E): The number density of the conductive particles is 6000-36000/mm2.
Inventors:
KUBODE HIROMI (JP)
TSUKAO REIJI (JP)
TSUKAO REIJI (JP)
Application Number:
PCT/JP2019/038143
Publication Date:
April 09, 2020
Filing Date:
September 27, 2019
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R11/01; B32B7/025; B32B27/18; C08J5/18; H01B1/22; H01B5/16; H01R43/00
Domestic Patent References:
| WO2018101108A1 | 2018-06-07 | |||
| WO2018101106A1 | 2018-06-07 | |||
| WO2010032854A1 | 2010-03-25 |
Foreign References:
| JP2004164874A | 2004-06-10 | |||
| JP2007035574A | 2007-02-08 | |||
| JP2007035575A | 2007-02-08 | |||
| JP2001216841A | 2001-08-10 | |||
| JP2005327509A | 2005-11-24 | |||
| JP2013125651A | 2013-06-24 |
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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