ANISOTROPIC CONDUCTIVE FILM, AND LAMINATE

Title:

ANISOTROPIC CONDUCTIVE FILM, AND LAMINATE

Document Type and Number:

WIPO Patent Application WO/2019/074064

Kind Code:

A1

Abstract:

Provided are: an anisotropic conductive film that has excellent conductivity and adhesion; and a laminate. The anisotropic conductive film includes plate-like conductive particles and a curable resin layer that contains the plate-like conductive particles. The surfaces of the plate-like conductive particles are oriented to be parallel to a plane that is orthogonal to the surface of the curable resin layer. When B is the average particle diameter of the particle diameters of the plate-like conductive particles as represented by the diameters of circumscribed circles of the plate-like conductive particles and T is the thickness of the curable resin layer, 1.1B≤T≤1.4B.

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Inventors:

KOBAYASHI HIROYUKI (JP)

Application Number:

PCT/JP2018/037940

Publication Date:

April 18, 2019

Filing Date:

October 11, 2018

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C08J5/18; B32B7/02; B32B27/18; H01B1/00; H01B5/16; H01R11/01; H01B1/22

Foreign References:

JP2005251647A	2005-09-15
JP2003187885A	2003-07-04
JP2006299025A	2006-11-02
JP2006249342A	2006-09-21
JP2018090768A	2018-06-14