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Title:
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/119131
Kind Code:
A1
Abstract:
 A first anisotropic conductive film (1A) has a first insulating resin layer (2) and a second insulating resin layer (3). The first insulating resin layer (2) is formed from a photopolymerizable resin, and the second insulating resin layer (3) is formed from a polymerizable resin. Conductive particles (10) are disposed in a single layer on the surface of the first insulating resin layer (2) which faces the second insulating resin layer (3). The first anisotropic conductive film (1A) further has a third insulating resin layer (4) formed from a polymerizable resin. A second anisotropic conductive film (1B) has an intermediate insulating resin layer (6). The intermediate insulating resin layer (6) is formed from a resin that does not include a polymerization initiator, and is in contact with the conductive particles (10). These anisotropic conductive films (1A, 1B) exhibit good connection reliability.

Inventors:
TSUKAO Reiji (Gate City Osaki East Tower 8F. 1-11-2, Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
AKUTSU Yasushi (Gate City Osaki East Tower 8F. 1-11-2, Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
Application Number:
JP2015/053040
Publication Date:
August 13, 2015
Filing Date:
February 04, 2015
Export Citation:
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Assignee:
DEXERIALS CORPORATION (Gate City Osaki East Tower 8F, 1-11-2 Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
International Classes:
H01R11/01; B23B5/30; C09J4/00; C09J4/02; C09J7/00; C09J9/02; C09J11/00; C09J163/00; C09J201/00; H01B5/16; H01L21/60; H01R43/00
Foreign References:
JP2013105636A2013-05-30
JP2001052778A2001-02-23
JPH08148211A1996-06-07
JP2008034232A2008-02-14
JP2010257991A2010-11-11
JP2010199087A2010-09-09
JP2013058412A2013-03-28
JP2013149466A2013-08-01
JP2012172128A2012-09-10
JP2012169263A2012-09-06
Attorney, Agent or Firm:
TAJIME & TAJIME (Room No. 201, New-Well-Ikuta Bldg. 26-28, Mita 1-chome, Tama-ku, Kawasaki-sh, Kanagawa 34, 〒2140034, JP)
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