Title:
ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/098329
Kind Code:
A1
Abstract:
The present invention relates to an anisotropic conductive film with improved adhesive strength after temporary pressure-bonding and/or regular pressure-bonding said film, and comprising: a conductive layer comprising conductive particles; and a plurality of insulating fine protrusions formed on said conductive layer. In addition, the present invention relates to a semiconductor device bonded and joined using said anisotropic conductive film.
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Inventors:
HAN JAE SUN (KR)
SEO JOON MO (KR)
LEE KIL YONG (KR)
EUN JONG HYUK (KR)
SEO JOON MO (KR)
LEE KIL YONG (KR)
EUN JONG HYUK (KR)
Application Number:
PCT/KR2013/004729
Publication Date:
June 26, 2014
Filing Date:
May 30, 2013
Export Citation:
Assignee:
CHEIL IND INC (KR)
International Classes:
H01B5/00; H01B1/20; H01B13/00
Foreign References:
| JPH08249930A | 1996-09-27 | |||
| KR100907576B1 | 2009-07-14 | |||
| KR20120028583A | 2012-03-23 | |||
| JPH0547219A | 1993-02-26 | |||
| US7645512B1 | 2010-01-12 |
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
특허법인에이아이피 (KR)
특허법인에이아이피 (KR)
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