Title:
ANISOTROPIC CONDUCTIVE FILM, UNITED OBJECT, AND PROCESS FOR PRODUCING UNITED OBJECT
Document Type and Number:
WIPO Patent Application WO/2012/066897
Kind Code:
A1
Abstract:
An anisotropic conductive film for electrically connecting a first circuit member to a second circuit member, the first circuit member having an insulating film formed in at least part thereof. The anisotropic conductive film comprises a layer which contains electroconductive particles and an insulating adhesion layer formed from an insulating adhesive, the insulating adhesion layer having an average thickness of 0.5-3 µm and giving, upon curing, a cured object which has a storage modulus measured at 30ºC of 500-1,500 MPa.
Inventors:
HAYASHI SHINICHI (JP)
SATO SHINICHI (JP)
HAMACHI HIROSHI (JP)
SATO SHINICHI (JP)
HAMACHI HIROSHI (JP)
Application Number:
PCT/JP2011/074265
Publication Date:
May 24, 2012
Filing Date:
October 21, 2011
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
HAYASHI SHINICHI (JP)
SATO SHINICHI (JP)
HAMACHI HIROSHI (JP)
HAYASHI SHINICHI (JP)
SATO SHINICHI (JP)
HAMACHI HIROSHI (JP)
International Classes:
H01R11/01; C09J7/22; C09J9/02; C09J179/04; C09J201/00; H01B5/16; H01R43/00; H05K1/14; H05K3/36
Foreign References:
| JP2009094493A | 2009-04-30 | |||
| JP2008288551A | 2008-11-27 | |||
| JP2009194359A | 2009-08-27 | |||
| JP2007112949A | 2007-05-10 | |||
| JP2008291199A | 2008-12-04 |
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
Koichi Hirota (JP)
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Claims: