Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ANISOTROPIC CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2012/141027
Kind Code:
A1
Abstract:
An anisotropic conductive film comprising a heat-curable epoxy resin composition and conductive particles dispersed in the heat-curable epoxy resin composition, wherein the heat-curable epoxy resin composition comprises an epoxy resin, a curing agent for epoxy resins and a film-forming resin, and wherein the epoxy resin to be used comprises a β-alkylglycidyl-type epoxy resin and a glycidyl-ether-type epoxy resin at a ratio of 9:1 to 2:8 by mass. The β-alkylglycidyl-type epoxy resin is preferably di(β-methylglycidyl) resorcinol ether, and the glycidyl-ether-type epoxy resin is preferably an alkylene-oxide-modified glycidyl-ether-type epoxy resin.

Inventors:
DEGUCHI SHINGO (JP)
Application Number:
PCT/JP2012/058917
Publication Date:
October 18, 2012
Filing Date:
April 02, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
DEGUCHI SHINGO (JP)
International Classes:
C08G59/20; C09J7/10; C09J9/02; C09J163/00; C09J201/00; H01B5/16; H01L21/60; H01R11/01
Foreign References:
JP2010278025A2010-12-09
JP2006137825A2006-06-01
JP2005307031A2005-11-04
JP2007269979A2007-10-18
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)
Download PDF:
Claims:



 
Previous Patent: FUSION PROTEIN

Next Patent: WIRELESS POWER SUPPLY SYSTEM