ANISOTROPIC CONDUCTIVE FILM

WIPO Patent Application WO/2016/114314

A1

This anisotropic conductive film is capable of connecting, with stable conduction characteristics, even a terminal that is formed on a substrate having a surface with waves such as a ceramic module substrate. An anisotropic conductive film according to the present invention comprises an insulating adhesive layer and conductive particles that are regularly arranged in the insulating adhesive layer when viewed in plan. The conductive particles have a diameter of 10 μm or more, and the film has a thickness that is equal to or more but 3.5 times or less the conductive particle diameter. The variation range of conductive particles in the thickness direction of the film is less than 10% of the conductive particle diameter.

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SATO DAISUKE (JP)
AKUTSU YASUSHI (JP)
ODAKA RYOUSUKE (JP)
TANAKA YUSUKE (JP)

PCT/JP2016/050858

July 21, 2016

January 13, 2016

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DEXERIALS CORP (JP)

H01R11/01; C09J7/10; G02B7/02; G03B17/02; H01B1/22; H01B5/16; H04N5/225; H04N5/335

WO2014030753A1	2014-02-27
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WO2006075381A1	2006-07-20

JP2014060025A	2014-04-03
JP2014159575A	2014-09-04
JP2012099729A	2012-05-24
JP2013110226A	2013-06-06
JP2014022248A	2014-02-03
JP2014102943A	2014-06-05
JP4887700B2	2012-02-29
JP2013516656A	2013-05-13

TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)

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