Title:
ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2012/043493
Kind Code:
A1
Abstract:
Provided are: an anisotropic conductive film material which has excellent connection reliability under high temperature, high humidity conditions; and a method for producing the anisotropic conductive film material. Good bonding strength is obtained by using a polycarbonate diol having excellent heat resistance as a polyol that serves as a polyurethane resin starting material and blending the polycarbonate diol with a polyether diol at a mass ratio (polycarbonate diol):( polyether diol) of from 3:7 to 9:1.
Inventors:
HAMACHI HIROSHI (JP)
Application Number:
PCT/JP2011/071921
Publication Date:
April 05, 2012
Filing Date:
September 26, 2011
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
HAMACHI HIROSHI (JP)
HAMACHI HIROSHI (JP)
International Classes:
C09J175/04; C09J4/02; C09J5/06; C09J7/00; C09J9/02; H01B1/22; H01B5/16; H01B13/00; H01R11/01
Domestic Patent References:
| WO2001015505A1 | 2001-03-01 |
Foreign References:
| JPH0532755A | 1993-02-09 | |||
| JP2003137963A | 2003-05-14 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
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Claims: