Title:
ANISOTROPIC CONDUCTIVE MATERIAL, ANISOTROPIC CONDUCTIVE SHEET, ANISOTROPIC CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/070436
Kind Code:
A1
Abstract:
An anisotropic conductive material containing two or more resin components and conductive particles, wherein the resin components in the anisotropic conductive material form a phase separation structure during curing and the conductive particles are unevenly distributed in the continuous phase in the phase separation structure; an anisotropic conductive sheet; an anisotropic conductive paste; and a connection structure and a method for producing the same.
Inventors:
KONNO TATSUYA (JP)
OKAMOTO SYUJI (JP)
SEKIYA TOSHIO (JP)
OKAMOTO SYUJI (JP)
SEKIYA TOSHIO (JP)
Application Number:
PCT/JP2023/031395
Publication Date:
April 04, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
C08L101/00; C08K3/01; C08K9/04; H01B5/16; H01R11/01
Domestic Patent References:
| WO2002028574A1 | 2002-04-11 |
Foreign References:
| JP2015221875A | 2015-12-10 | |||
| JP2012150903A | 2012-08-09 | |||
| JP2012092321A | 2012-05-17 | |||
| JP2009105361A | 2009-05-14 | |||
| JP2012140594A | 2012-07-26 | |||
| JPH11185526A | 1999-07-09 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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