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Patent Searching and Data


Title:
ANISOTROPIC CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/176545
Kind Code:
A1
Abstract:
Provided are: an anisotropic conductive sheet with which excellent conductivity in the direction of sheet thickness can be obtained and excellent insulation between adjacent terminals can be obtained; and a method for manufacturing the anisotropic conductive sheet. This anisotropic conductive sheet is formed of a resin composition that contains: a curable compound; an insulating inorganic filler; and solder particles. The insulating inorganic filler content is 1 to 10 parts by mass with respect to the curable compound content of 100 parts by mass. The solder particles are arranged in the direction of thickness and fused to each other. Due to this configuration, excellent conductivity in the direction of the sheet thickness can be obtained, and excellent insulation between adjacent terminals can be obtained.

Inventors:
KUMAKURA HIROYUKI (JP)
Application Number:
PCT/JP2019/007664
Publication Date:
September 19, 2019
Filing Date:
February 27, 2019
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R11/01; H01B1/22; H01B5/16; H01B13/00; H01R43/00
Domestic Patent References:
WO2016114160A12016-07-21
Foreign References:
JP2007332224A2007-12-27
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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