Title:
ANISOTROPIC CONDUCTOR, METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTOR, AND ANISOTROPIC CONDUCTOR ARRANGEMENT SHEET
Document Type and Number:
WIPO Patent Application WO/2011/027692
Kind Code:
A1
Abstract:
In an anisotropic conductor having an adhesive portion, provided is a technique capable of selecting an adhesive material that can exert a high adhesiveness on an object to be secured, without being restricted by the material of an insulating base portion. A relay sheet (14) is provided that is interposed between a base portion (12) and an adhesive portion (15) and can be firmly fixed to the base portion (12). This relay sheet (14) makes it possible to select, without considering the fixing strength to the base portion (12), the adhesive portion (15) formed of an adhesive material that exerts a high adhesive strength on an object to be secured. As a result, the fixing strength between the adhesive portion (15) and the object to be secured can be obtained that cannot be obtained when the adhesive portion (15) and the base portion (12) directly contact each other.
Inventors:
NAKAONE Yutaka (10-5, Tabata 5-chome, Kita-k, Tokyo 14, 〒1140014, JP)
Application Number:
JP2010/064365
Publication Date:
March 10, 2011
Filing Date:
August 25, 2010
Export Citation:
Assignee:
Polymatech Co. , Ltd. (8-16, Nihonbashihoncho 4-chome Chuo-k, Tokyo 24, 〒1038424, JP)
ポリマテック株式会社 (〒24 東京都中央区日本橋本町４丁目８－１６ Tokyo, 〒1038424, JP)
ポリマテック株式会社 (〒24 東京都中央区日本橋本町４丁目８－１６ Tokyo, 〒1038424, JP)
International Classes:
H01R11/01; C09J7/02; H01B5/16; H01B13/00; H01R43/00
Attorney, Agent or Firm:
OHTAKE Seigo et al. (Dai 4 Matsuzaka Bldg, 33-5 Higashiazabu 2-chome, Minato-k, Tokyo 44, 〒1060044, JP)