Title:
ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, ELECTRONIC ELEMENT, STRUCTURE INCLUDING SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/203884
Kind Code:
A1
Abstract:
Provided are: an anisotropic electroconductive material that is suitable for bonding a semiconductor chip and a semiconductor wafer, etc.; an electronic element having the anisotropic electroconductive member; a structure that includes the semiconductor element having the anisotropic electroconductive member; and a method for manufacturing the electronic element in which the anisotropic electroconductive member is used. The anisotropic electroconductive material has a support body and the anisotropic electroconductive member. The anisotropic electroconductive member is provided with: an insulating base material comprising an inorganic material; and a plurality of conductive paths that penetrates through in the thickness direction of the insulating base material, the conductive paths being provided in a state of being electrically insulated from each other, and the conductive paths comprising an electroconductive material. The anisotropic electroconductive member is provided on the support body, and is formed in a pattern shape in which a region indicating anisotropic electroconductivity is set.
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Inventors:
HOTTA YOSHINORI (JP)
YAMASHITA KOSUKE (JP)
YAMASHITA KOSUKE (JP)
Application Number:
PCT/JP2017/015232
Publication Date:
November 30, 2017
Filing Date:
April 14, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/60; H01R11/01
Foreign References:
| JP2011090865A | 2011-05-06 | |||
| JP2012204285A | 2012-10-22 | |||
| JP2002094222A | 2002-03-29 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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