Title:
ANISOTROPICALLY CONDUCTIVE SHEET AND ANISOTROPICALLY CONDUCTIVE SHEET MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/065089
Kind Code:
A1
Abstract:
Provided are an anisotropically conductive sheet which can be used for the inspection of a semiconductor package or a high frequency component having a narrowed wiring pitch and thinned wiring, and which can be easily manufactured, and an anisotropically conductive sheet manufacturing method. The anisotropically conductive sheet 1 of the present invention comprises an insulating sheet body 3 having a plurality of through-holes 2 penetrating therethrough in a thickness direction, and an electrically conductive path 4 formed in the through-holes 2, and is characterized in that the electrically conductive path 4 is formed by curing an electrically conductive material 7 including at least electrically conductive nanoparticles and a binder resin, wherein the electrically conductive material 7 has a viscosity of not more than 100000 mPa·s.
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Inventors:
MORITA MINORU (JP)
Application Number:
PCT/JP2018/032439
Publication Date:
April 04, 2019
Filing Date:
August 31, 2018
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01R11/01; H01B1/24; H01B5/16; H01R43/00; H05K1/14; H05K3/32
Foreign References:
| JPH0660930A | 1994-03-04 | |||
| JP2010539650A | 2010-12-16 | |||
| JP2017133042A | 2017-08-03 | |||
| JP6174292B1 | 2017-08-02 | |||
| JPH11354178A | 1999-12-24 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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