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Title:
ANODE CHAMBER LIQUID MANAGEMENT METHOD, AND PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/248286
Kind Code:
A1
Abstract:
An anode chamber liquid management method comprising: a step for preparing a plating tank in which an anode and a diaphragm in contact with or attached firmly to the upper surface of the anode are arranged, and which is provided with a cathode chamber and an anode chamber partitioned above and below by the diaphragm, and an exhaust passage that is connected to the anode chamber and that is for discharging air bubbles from the anode chamber to the outside of the plating tank; a step for holding a plating liquid in the anode chamber and the cathode chamber such that the liquid level that is of the plating liquid in the exhaust passage and that is equal to the liquid level of the plating liquid in the anode chamber becomes lower than the liquid level of the plating liquid in the cathode chamber; a step for determining whether the height of the liquid level of the plating liquid in the exhaust passage is lower than a prescribed height, on the basis of an output of a liquid level sensor disposed in the exhaust passage; and a step for feeding pure water or an electrolytic solution to the anode chamber when the height of the liquid level of the plating liquid in the exhaust passage is determined as being lower than the prescribed height.

Inventors:
TOMITA MASAKI (JP)
MASUDA YASUYUKI (JP)
Application Number:
PCT/JP2022/024506
Publication Date:
December 28, 2023
Filing Date:
June 20, 2022
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
C25D21/00
Foreign References:
US20120138471A12012-06-07
JP2017125251A2017-07-20
JPH09264000A1997-10-07
JP2014234538A2014-12-15
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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