Title:
ANODIZING PROCESSING METHOD AND METHOD OF MANUFACTURING ANISOTROPIC CONDUCTIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2020/166240
Kind Code:
A1
Abstract:
Provided are an anodizing processing method capable of forming a straight micropore and a method of manufacturing an anisotropic conductive member having a suppressed conductive material filling defect. The present invention is an anodizing processing method which performs anodizing processing on the surface of a valve metal plate several times, and forms, on the surface of the valve metal plate, an anodizing film including micropores disposed in the thickness direction of the valve metal plate and a barrier layer disposed at the bottom part of the micropores. Among multiple anodizing processings, in anodizing processing steps after a second step, a current increase period and a current maintained period are consecutive. The current increase period is a period which is equal to or shorter than 10 minutes and in which a current increase amount exceeds 0 ampere per square meter per second and is equal to or smaller than 0.2 ampere per square meter per second. In the current maintained period, a current value is maintained at a constant value, and the constant value is equal to or smaller than the maximum current value in the current increase period.
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Inventors:
HOTTA YOSHINORI (JP)
KUROOKA SHUNJI (JP)
KUROOKA SHUNJI (JP)
Application Number:
PCT/JP2020/000545
Publication Date:
August 20, 2020
Filing Date:
January 10, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C25D11/04; B82Y30/00; B82Y40/00; C25D11/12; C25D11/20; H01B13/00
Domestic Patent References:
| WO2015079706A1 | 2015-06-04 | |||
| WO2015012234A1 | 2015-01-29 |
Foreign References:
| JPS5433573B2 | 1979-10-22 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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