CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of ET.S. Provisional Application Serial No. 62/729,049, filed September 10, 2018, which is incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

[0002] The present disclosure relates generally to a device for an electromagnetic, EM, application, and more particularly to an antenna component having a shielded EM signal feed region.

[0003] Antenna arrays that are fed by a single EM signal feed may experience unequal distribution of EM energy to the individual antenna elements of the array, particularly where the array is and x-by-y array having more than one row deep of antenna elements, which may lead to a less efficient antenna, and/or an antenna that has less than optimal gain.

[0004] While existing antenna arrays may be suitable for their intended purpose, the art of antenna arrays would be advanced with an antenna component having a structure that improves the distribution of the EM energy to the several antenna elements of the antenna array, thereby overcoming existing drawbacks in presently available antenna arrays.

BRIEF DESCRIPTION OF THE INVENTION

[0005] An embodiment includes a device for an electromagnetic, EM, application, the device having: an EM signal feed component; a first electrical conductor component disposed below the EM signal feed component; a second electrical conductor component disposed above the EM signal feed component; and wherein the first and second electrical conductor components are electrically connected to each other.

[0006] Another embodiment includes a device for an electromagnetic, EM, application, the device having: an electrically conductive component having a defined overall thickness t, a lower side, and an upper side that is electrically connected to the lower side; the electrically conductive component having a first region, and a second region that is electrically connected to the first region; the first region having a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion; and the second region having a plurality of cavities that extend completely through the thickness t.

[0007] Another embodiment includes a device for an electromagnetic, EM, application, the device having: a first component having an electrically conductive upper side, and an electrically conductive lower side that is electrically connected to the electrically conductive upper side; a second component having a defined overall thickness t, an electrically conductive upper side, and an electrically conductive lower side disposed on top of the first component, wherein the electrically conductive lower side of the second component is electrically connected to the electrically conductive upper side of the first component; the first and second components having in combination a first region, and a second region that is electrically connected to the first region; wherein the first component includes an EM signal feed disposed in the first region, and at least one EM antenna disposed in the second region, the at least one EM antenna configured to be in EM signal

communication with the EM signal feed; wherein the second component includes a recessed portion disposed in the first region that extends from the lower side of the second component toward the upper side of the second component with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion, the recessed portion being disposed over the EM signal feed of the first component; wherein the second component further includes at least one cavity disposed in the second region that extends completely through the thickness t of the second component, the at least one cavity being disposed in a one-to-one corresponding relationship with the at least one EM antenna.

[0008] Another embodiment includes a method of making a device for an

electromagnetic, EM, application, the method including: providing a dielectric component having a defined overall thickness t, a lower side, an upper side, a first region having a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion, and a second region having a plurality of cavities with side walls that extend completely through the thickness t; and coating the lower and upper sides of the dielectric component and the side walls of the plurality of cavities with an electrically conductive material, such that the upper side is electrically connected to the lower side via the side walls of the plurality of cavities of the second region.

[0009] Another embodiment includes a method of making a device for an

electromagnetic, EM, application, the method including: providing a two-sided metal clad dielectric substrate having a defined overall thickness t, a lower electrically conductive side, an upper electrically conductive side, a first region, and a second region; forming in the first region a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion; forming in the second region a plurality of cavities with side walls that extend completely through the thickness t; and coating the side walls of the plurality of cavities with an electrically conductive material, such that the upper side is electrically connected to the lower side via the side walls of the plurality of cavities of the second region. In an embodiment,

[0010] The above features and advantages and other features and advantages of the invention are readily apparent from the following detailed description of the invention when taken in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Referring to the exemplary non-limiting drawings wherein like elements are numbered alike in the accompanying Figures:

[0012] FIG. 1 depicts a plan view of a generic schematic layout of an example embodiment of a device for an EM application, in accordance with an embodiment;

[0013] FIG. 2 depicts a rotated isometric view of a disassembled assembly view of the device of FIG. 1 having a first lower component (first component), and a second upper component (second component) disposed on top of and electrically connected to the first component, in accordance with an embodiment;

[0014] FIG. 3 depicts a rotated isometric view of the second region of the first component of FIG. 2, in accordance with an embodiment;

[0015] FIG. 4 depicts a section cut through cut line A- A of FIGS. 2 and 3;

[0016] FIG. 5 depicts a section cut through cut line B-B of FIGS. 2 and 3;

[0017] FIG. 6 depicts a section cut through cut line C-C of FIGS. 2 and 3;

[0018] FIG. 7 depicts a rotated isometric view of the first region 102 of the first component 200 similar to that of FIG. 3, but illustrating further detail of an antenna array feed that is disposed proximate and in signal communication with the EM signal feed component, in accordance with an embodiment;

[0019] FIG. 8 depicts a method of making at least a portion of the device of FIG. 1, in accordance with an embodiment; and

[0020] FIG. 9 depicts an alternative method to that of FIG. 8, in accordance with an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] Although the following detailed description contains many specifics for the purposes of illustration, one of ordinary skill in the art will appreciate that many variations and alterations to the following details are within the scope of the claims. Accordingly, the following example embodiments are set forth without any loss of generality to, and without imposing limitations upon, the claimed invention.

[0022] An embodiment, as shown and described by the various figures and accompanying text, provides a device for an EM application, and more particularly an antenna component having a shielded EM signal feed region, where in an example embodiment the device has an EM signal feed component and an EM shield component, where the EM shield component provides a shielded EM signal feed region with respect to the EM signal feed. The EM signal feed component and the EM shield component work in combination to reduce EM reflections of EM radiation originating from the EM signal feed and propagating towards an array of antenna elements of the device. While the embodiment described and illustrated herein depicts a particular type and geometry for an antenna element, such as a dome shaped dielectric resonator antenna, DRA, for example, it will be appreciated that the disclosed invention is also applicable to other types of antennas or EM radiating elements, such as patch antennas for example.

[0023] The several figures provided herein are first described generally, and then referred to in detail.

[0024] FIG. 1 depicts a plan view of a generic schematic layout of an example embodiment of a device 100 for an EM application, the device 100 having a first region 102 having an EM signal feed, and that serves as a shielded EM signal feed region, and a second region 103 having an array of antennas, and that serves as an antenna array region, where the antennas are configured to be in EM signal communication with the EM signal feed

(discussed in more detail below).

[0025] FIG. 2 depicts a rotated isometric view of a disassembled assembly view of the device 100 having a first lower component (first component) 200, and a second upper component (second component) 300 disposed on top of and electrically connected to the first component 200. The first and second regions 102, 104 are in reference to both the first and second components 200, 300, such that the first and second components 200, 300 in combination include the first and second regions 102, 104, which are electrically connected to each other. FIG. 2 includes section cut lines A- A, B-B, and C-C, which will be discussed further in reference to FIGS. 4-6, recognizing that the subject cut lines cut through both the first and second components 200, 300 when assembled.

[0026] FIG. 3 depicts a rotated isometric view of the first region 102 of the first component 200. FIG. 3 includes the section cut lines A- A, B-B, and C-C, with respect to only the first component 200.

[0027] FIG. 4 depicts a section cut through cut line A- A of FIGS. 2 and 3.

[0028] FIG. 5 depicts a section cut through cut line B-B of FIGS. 2 and 3.

[0029] FIG. 6 depicts a section cut through cut line C-C of FIGS. 2 and 3.

[0030] Reference is now made to FIGS. 1-6 collectively.

[0031] In an embodiment, the first component 200 includes an EM signal feed component 202 and a first electrical conductor component 204, where the first component 200 has an electrically conductive upper side 206, and an electrically conductive lower side, also referred to by reference numeral 204, that is electrically connected to the electrically conductive upper side 206 by way of electrically conductive vias 208. Signal return components 210 flank both sides of the EM signal feed component 202, which are

structurally and electrically separated from each other by an absence 212 of electrically conductive material of the electrically conductive upper side 206. The first electrical conductor component 204 also includes an electrically conductive island portion 214, best seen by comparing the cross section views of FIGS. 4-6, where the island portion 214 is seen only in FIG. 4, and is electrically isolated from the remaining portion of the first electrical conductor component 204 by an absence 216 of electrically conductive material of the first electrical conductor component 204, see FIGS. 4-5 for example. The first electrical conductor component 204 provides and defines a reference voltage potential of the device 100. The island portion 214 is electrically connected to the EM signal feed component 202 by way of at least one electrically conductive via 218. As will be appreciated from the foregoing, the electrically conductive lower side 204 of the first component 200 provides the first electrical conductor component 204 and the electrically conductive island portion 214, which may be configured as a layer of conductive material, and the electrically conductive upper side 206 of the first component 200 provides the EM signal feed component 202 and the signal return components 210, which may be configured as a layer of conductive material.

[0032] In an embodiment, the second component 300 includes a second electrical conductor component 302 having a defined overall thickness t, an electrically conductive upper side (also referred to by reference numeral 302), and an electrically conductive lower side 304. The electrically conductive lower side 304 of the second component 300 is disposed on top of and is electrically connected to the electrically conductive upper side 206 of the first component 200. In an embodiment, the second component 300 is electrically connected to the first component 200 via an electrically conductive adhesive 106 (see FIG. 4 for example), or by way of any other means that provides an electrical connection suitable for a purpose disclosed herein, such as a solder or vibratory friction bond for example. As will be appreciated from the foregoing, the electrically conductive upper side 302 of the second component 300 provides the second electrical conductor component 302, which may be configured as a layer of conductive material.

[0033] In an embodiment, the device 100 includes at least one EM antenna 400 disposed in the second region 104 on the electrically conductive upper side 206 of the first component 200, where the at least one EM antenna 400 is configured to be in EM signal communication with the EM signal feed 202. In an embodiment, the EM signal

communication between the EM signal feed 202 and the at least one antenna 400 is by way of a coplanar waveguide 220 formed in the first component 200 by way of the electrically conductive vias 208 between the lower 204 and upper 206 conductive sides of the first component 200. In an embodiment, the at least one EM antenna 400 is a dielectric resonator antenna, DRA. In an embodiment, the at least one antenna 400 is a plurality of antennas arranged in an x-by-y array (see the 4-by-4 array depicted in FIG. 2 for example).

[0034] In an embodiment, the second component 300 has a recessed portion 306 (see FIGS. 2 and 4 for example) disposed in the first region 102 that extends from the lower side 304 of the second component 300 toward the upper side 302 of the second component 300 with a recess dimension d that is less than t that forms a ceiling 308 and side walls 310 of the recessed portion 306, where the recessed portion 306 is disposed over the EM signal feed 202 of the first component 200. In an embodiment, the second component 300 further includes at least one cavity 312 (see FIG. 2 for example) disposed in the second region 104 that extends completely through the thickness t of the second component 300, where the at least one cavity 312 is disposed in a one-to-one corresponding relationship with the at least one EM antenna 400. In an embodiment, the at least one cavity 312 has an electrically conductive side wall 318 that substantially surrounds a corresponding one of the at least one EM antenna 400, where each side wall 318 is electrically connected to the upper and lower sides 302, 304 of the second component 300. The electrically conductive side walls 318 serve as an EM reflector that influences the EM radiation that propagates from a corresponding EM antenna 400 when electromagnetically excited. [0035] In an embodiment, the first component 200 is manufactured from a two-sided metal clad dielectric substrate having a central region of a dielectric material 222, and the cladding is provided by the electrically conductive lower and upper sides 204, 206 of the first component 200. In an embodiment, the cladding is copper. As noted herein above, the electrically conductive lower and upper sides 204, 206 of the first component 200 are electrically connected to each other by way of vias 208 that are substantially filled with an electrically conductive material, which may be copper, and the EM signal feed 202 is configured in the electrically conductive upper side 206 of the first component 200 by way of an absence 212 of electrically conductive material of the upper side 206 of the first component 200. As also noted herein above, the EM signal feed 202, and the vias 208 that electrically connect the upper and lower sides 204, 206 of the first component 200, provide the coplanar waveguide 220 configured to be in EM signal communication with the at least one EM antenna 400.

[0036] In an embodiment, the second component 300 is manufactured from a dielectric material 314 having electrically conductive material on the lower side 304, and electrically conductive material on the upper side 302 that is electrically connected to the electrically conductive material on the lower side 304, that may be electrically connected by way of electrically conductive vias 316 (see FIG. 2 for example) through the dielectric material 314. The electrically conductive material may be copper, for example. In an embodiment, the dielectric material 314 of the second component 300 is a glass-reinforced epoxy laminate material. In an alternative embodiment, the dielectric material 314 of the second component 300 is a moldable polymer, such as a thermoplastic or a thermoset material. In an embodiment, the ceiling 308 and side walls 310 of the recessed portion 306 of the second component 300 have an electrically conductive material disposed thereon (as shown in FIG. 4), such that the ceiling 308 of the recessed portion 306 is electrically connected to the electrically conductive material on the lower side 304 of the second component 300 via the side walls 310 of the recessed portion 306 of the second component 300 (as shown in FIG. 4). In an alternative embodiment, the ceiling 308 and the side walls 310 of the recessed portion 306 are composed of the dielectric material 314 of the second component 300 absent an electrically conductive material, which is not specifically shown but would be readily understood by one skilled in the art by removing the corresponding metal coatings shown on the ceiling 308 and side walls 310 of the recessed portion 306 in FIG. 4. [0037] In an alternative embodiment, the second component 300 is manufactured from a single piece of metal, such as copper for example, which may be machined, cast, 3D printed, or formed in any other manner suitable for a purpose disclosed herein.

[0038] In an embodiment, the recessed portion 306 of the second component 300 is air. In an alternative embodiment, the recessed portion 306 of the second component 300 is a dielectric material that is other than air having a dielectric constant that is equal to or greater than one and equal to or less than five. In an embodiment, the recessed portion 306 is open ended, as shown in FIG. 2. In an alternative embodiment, the recessed portion 306 is closed ended, which is not specifically shown but would be readily understood by one skilled in the art by closing off the open end of the recessed portion 306 depicted in FIG. 2.

[0039] From the foregoing, it will be appreciated that the upper side 302 of the second component 300 (alternatively herein referred to as an upper EM shield) is electrically connected the lower side 204 of the first component 200 by way of the electrically conductive vias 316, the electrical connection 106, and the electrically conductive vias 208. The upper side 302 may be viewed as an upper EM shield, and the lower side 204 may be viewed as a lower EM shield, where the combination of the upper EM shield, the lower EM shield, and the recessed portion 306 disposed over the EM signal feed 202 of the first component 200, may be viewed as a shielded dielectric channel.

[0040] Reference is now made to FIG. 7, in combination with FIGS. 1-6 with particular further reference to FIG. 4, where FIG. 7 depicts a rotated isometric view of the first region 102 of the first component 200 similar to that of FIG. 3, but illustrating further detail of an antenna array feed 500 that is disposed proximate and in signal communication with the EM signal feed component 202. In an embodiment, the antenna array feed 500 includes a feed pad 502 that is electrically connected to the island portion 214 of the first electrical conductor component 204 of the first component 200, which is electrically connected to the EM signal feed component 202 by way of the electrically conductive via 218, thereby providing a pathway for EM signal communication from the antenna array feed pad 502 to the EM signal feed component 202.

[0041] In view of the foregoing description of structure, it will be appreciated that a method or methods of making said structure is also disclosed herein, wherein such method(s) include at least the following.

[0042] In an embodiment and with reference to FIG. 8, a method 600 of making at least a portion of the device 100 for an EM application includes: providing 602 a dielectric component having a defined overall thickness t, a lower side, an upper side, a first region having a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion, and a second region having a plurality of cavities with side walls that extend completely through the thickness t; and coating 604 the lower and upper sides of the dielectric component and the side walls of the plurality of cavities with an electrically conductive material, such that the upper side is electrically connected to the lower side via the side walls of the plurality of cavities of the second region. In an embodiment, the method step of providing 602 comprises molding the dielectric component, which may include injection molding a thermoplastic or thermoset polymer for example. In an alternative embodiment, the method step of providing 602 comprises providing a dielectric substrate having the defined overall thickness t, the lower side, and the upper side, and removing material from the dielectric substrate, via machining or any by any other means suitable for a purpose disclosed herein, to form the recessed portion in the first region and the plurality of cavities in the second region, to provide the dielectric component, where the dielectric substrate may be a glass-reinforced epoxy laminate material for example. In an embodiment, the method step of providing 602 further comprises providing at least one via that extends completely through the thickness t 606; and further comprising: substantially filling the at least one via with an electrically conductive material, such that the vias electrically connect the lower and upper sides 606. In an embodiment, the coating 604 further comprises coating the ceiling and side walls of the recessed portion with an electrically conductive material, such that the ceiling of the recessed portion is electrically connected to the lower side via the side walls 608.

[0043] In an embodiment and with reference to FIG. 9, an alternative method 700 of making at least a portion of the device 100 for an EM application includes: providing 702 a two-sided metal clad dielectric substrate having a defined overall thickness t, a lower electrically conductive side, an upper electrically conductive side, a first region, and a second region; forming in the first region 704 a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion; forming in the second region 706 a plurality of cavities with side walls that extend completely through the thickness t; and coating 708 the side walls of the plurality of cavities with an electrically conductive material, such that the upper side is electrically connected to the lower side via the side walls of the plurality of cavities of the second region. In an embodiment, the method 700 further comprises forming at least one via that extends completely through the thickness t; and substantially filling the at least one via with an electrically conductive material, such that the vias electrically connect the lower and upper sides 710. In an embodiment, the forming in the first region 704 the recessed portion comprises removing material from the two-sided metal clad dielectric substrate; and the forming in the second region 706 the plurality of cavities comprises removing material from the two-sided metal clad dielectric substrate. In an embodiment, the coating 708 further comprises coating the ceiling and side walls of the recessed portion with an electrically conductive material 712, such that the ceiling of the recessed portion is electrically connected to the lower side via the side walls.

[0044] From all of the foregoing, it will be appreciated that an embodiment of the invention includes at least the following arrangements.

[0045] Arrangement- 1 : A device for an electromagnetic, EM, application, comprising: an EM signal feed component; a first electrical conductor component disposed below the EM signal feed component; a second electrical conductor component disposed above the EM signal feed component; and wherein the first and second electrical conductor components are electrically connected to each other.

[0046] Arrangement-2: The device of Arrangement- 1, further comprising: an antenna array feed disposed proximate and in signal communication with the EM signal feed component.

[0047] Arrangement-3 : The device of Arrangement-2, wherein: the antenna array feed comprises a feed pad that is electrically connected to an island portion of the first electrical conductor component, the island portion being electrically connected to the EM signal feed component.

[0048] Arrangement-4: The device of any of Arrangements- 1 to 3, wherein: the EM signal feed component is configured as a layer; the first electrical conductor component is configured as a layer; the second electrical conductor component is configured as a layer.

[0049] Arrangement- 5 : The device of any of Arrangements- 1 to 4, wherein: the first electrical conductor component defines a reference voltage potential of the device.

[0050] Arrangement-6: The device of any of Arrangements- 1 to 5, wherein: the EM signal feed component and the first electrical conductor component are part of a first component having an electrically conductive upper side, and an electrically conductive lower side that is electrically connected to the electrically conductive upper side, the electrically conductive lower side of the first component providing the first electrical conductor component, the electrically conductive upper side of the first component providing the EM signal feed component; the second electrical conductor component is part of a second component having a defined overall thickness t, an electrically conductive upper side, and an electrically conductive lower side disposed on top of the first component, wherein the electrically conductive lower side of the second component is electrically connected to the electrically conductive upper side of the first component, the electrically conductive upper side of the second component providing the second electrical conductor component.

[0051] Arrangment-7 : The device of Arrangement-6, wherein: the first and second components have in combination a first region, and a second region that is electrically connected to the first region; the EM signal feed is disposed in the first region, and at least one EM antenna is disposed in the second region, the at least one EM antenna configured to be in EM signal communication with the EM signal feed; wherein the second component comprises a recessed portion disposed in the first region that extends from the lower side of the second component toward the upper side of the second component with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion, the recessed portion being disposed over the EM signal feed of the first component; wherein the second component further comprises at least one cavity disposed in the second region that extends completely through the thickness t of the second component, the at least one cavity being disposed in a one-to-one corresponding relationship with the at least one EM antenna.

[0052] Arrangement- 8: The device of Arrangement-7, wherein: the at least one EM antenna is a dielectric resonator antenna, DRA.

[0053] Arrangement-9: The device of any of Arrangements-7 to 8, wherein: the second component is electrically connected to the first component via an electrically conductive adhesive.

[0054] Arrangement- 10: The device of any of Arrangements-7 to 9, wherein: the first component comprises a two-sided metal clad dielectric substrate; the electrically conductive upper and lower sides of the first component are electrically connected to each other by way of vias that are substantially filled with an electrically conductive material; the EM signal feed is configured in the electrically conductive upper side of the first component by way of an absence of electrically conductive material of the upper side of the first component; and the EM signal feed, and the vias that electrically connect the upper and lower sides of the first component, provide a coplanar waveguide configured to be in EM signal communication with the at least one EM antenna.

[0055] Arrangement-l 1 : The device of any of Arrangements-7 to 10, wherein: the second component is a single piece of metal.

[0056] Arrangement- 12: The device of any of Arrangements-7 to 10, wherein: the second component comprises a dielectric material having an electrically conductive material on the lower side, and an electrically conductive material on the upper side that is electrically connected to the electrically conductive material on the lower side.

[0057] Arrangement-l3: The device of Arrangement- 12, wherein: the electrically conductive material on the lower side is electrically connected to the electrically conductive material on the upper side by way of electrically conductive vias through the dielectric material.

[0058] Arrangement-l4: The device of any of Arrangements- 12 to 13, wherein: the ceiling and side walls of the recessed portion have an electrically conductive material disposed thereon, such that the ceiling of the recessed portion is electrically connected to the electrically conductive material on the lower side of the second component via the side walls of the recessed portion of the second component.

[0059] Arrangement-l5: The device of any of Arrangements-7 to 10, wherein: the ceiling and the side walls of the recessed portion comprises the dielectric material of the second component absent an electrically conductive material.

[0060] Arrangement- 16: The device of any of Arrangements-7 to 15, wherein: the dielectric material of the second component comprises a glass-reinforced epoxy laminate material.

[0061] Arrangement- 17: The device of any of Arrangements-7 to 16, wherein: the recessed portion of the first region comprises a dielectric material that is other than air.

[0062] Arrangement-l8: The device of any of Arrangements-7 to 17, wherein: the recessed portion of the first region is open ended.

[0063] Arrangement- 19: The device of any of Arrangements-7 to 17, wherein: the recessed portion of the first region is closed ended.

[0064] Arrangement-20: The device of any of Arrangements-7 to 17, wherein: the at least one EM antenna is disposed on the electrically conductive upper side of the first component.

[0065] Arrangement-lOl : A device for an electromagnetic, EM, application, comprising: an electrically conductive component having a defined overall thickness t, a lower side, and an upper side that is electrically connected to the lower side; the electrically conductive component having a first region, and a second region that is electrically connected to the first region; the first region having a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion; and the second region having a plurality of cavities that extend completely through the thickness t. [0066] Arrangement- 102: The device of Arrangement- 101, wherein: the electrically conductive component is a single piece of metal.

[0067] Arrangement- 103: The device of Arrangement-lOl, wherein: the electrically conductive component comprises a dielectric component having an electrically conductive material on the lower side, and an electrically conductive material on the upper side that is electrically connected to the electrically conductive material on the lower side.

[0068] Arrangement- 104: The device of Arrangement- 103, wherein: the electrically conductive material on the lower side is electrically connected to the electrically conductive material on the upper side by way of electrically conductive vias through the dielectric component.

[0069] Arrangement- 105: The device of any of Arrangements- 103 to 104, wherein: the ceiling and side walls of the recessed portion have an electrically conductive material disposed thereon, such that the ceiling of the recessed portion is electrically connected to the electrically conductive material on the lower side via the side walls of the recessed portion.

[0070] Arrangement- 106: The device of any of Arrangements- 103 to 104, wherein: the ceiling and the side walls of the recessed portion comprises a dielectric material of the dielectric component absent an electrically conductive material.

[0071] Arrangement- 107: The device of any of Arrangements- 103 to 106, wherein: the dielectric component comprises a glass-reinforced epoxy laminate material.

[0072] Arrangement- 108: The device of any of Arrangements-lOl to 107, wherein: the recessed portion of the first region comprises a dielectric material that is other than air.

[0073] Arrangement- 109: The device of any of Arrangements-lOl to 108, wherein: the recessed portion of the first region is open ended.

[0074] Arrangement- 110: The device of any of Arrangements-lOl to 108, wherein: the recessed portion of the first region is closed ended.

[0075] Arrangement-201 : A device for an electromagnetic, EM, application, comprising: a first component having an electrically conductive upper side, and an electrically conductive lower side that is electrically connected to the electrically conductive upper side; a second component having a defined overall thickness t, an electrically conductive upper side, and an electrically conductive lower side disposed on top of the first component, wherein the electrically conductive lower side of the second component is electrically connected to the electrically conductive upper side of the first component; the first and second components having in combination a first region, and a second region that is electrically connected to the first region; wherein the first component comprises an EM signal feed disposed in the first region, and at least one EM antenna disposed in the second region, the at least one EM antenna configured to be in EM signal communication with the EM signal feed; wherein the second component comprises a recessed portion disposed in the first region that extends from the lower side of the second component toward the upper side of the second component with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion, the recessed portion being disposed over the EM signal feed of the first component; wherein the second component further comprises at least one cavity disposed in the second region that extends completely through the thickness t of the second component, the at least one cavity being disposed in a one-to-one corresponding relationship with the at least one EM antenna.

[0076] Arrangement-202: The device of Arrangement-201, further comprising: an antenna array feed disposed proximate and in signal communication with the EM signal feed.

[0077] Arrangemtn-203 : The device of Arrangement-202, wherein: the antenna array feed comprises a feed pad that is electrically connected to an island portion of the electrically conductive lower side of the first component, the island portion being electrically connected to the EM signal feed.

[0078] Arrangement-204: The device of any of Arrangements-20l to 203, wherein: the at least one EM antenna is a dielectric resonator antenna, DRA.

[0079] Arrangement-205: The device of any of Arrangements-20l to 204, wherein: the second component is electrically connected to the first component via an electrically conductive adhesive.

[0080] Arrangement-206: The device of any of Arrangements-20l to 205, wherein: the first component comprises a two-sided metal clad dielectric substrate; the electrically conductive upper and lower sides of the first component are electrically connected to each other by way of vias that are substantially filled with an electrically conductive material; the EM signal feed is configured in the electrically conductive upper side of the first component by way of an absence of electrically conductive material of the upper side of the first component; and the EM signal feed, and the vias that electrically connect the upper and lower sides of the first component, provide a coplanar waveguide configured to be in EM signal communication with the at least one EM antenna.

[0081] Arrangement-207: The device of any of Arrangements-20l to 206, wherein: the second component is a single piece of metal.

[0082] Arrangement-208: The device of any of Arrangements-20l to 206, wherein: the second component comprises a dielectric material having an electrically conductive material on the lower side, and an electrically conductive material on the upper side that is electrically connected to the electrically conductive material on the lower side.

[0083] Arrangement-209: The device of Arrangement-208, wherein: the electrically conductive material on the lower side of the second component is electrically connected to the electrically conductive material on the upper side of the second component by way of electrically conductive vias through the dielectric material of the second component.

[0084] Arrangement-210: The device of any of Arrangements-208 to 209, wherein: the ceiling and side walls of the recessed portion have an electrically conductive material disposed thereon, such that the ceiling of the recessed portion is electrically connected to the electrically conductive material on the lower side via the side walls of the recessed portion.

[0085] Arrangement-211 : The device of any of Arrangements-208 to 209, wherein: the ceiling and the side walls of the recessed portion comprises the dielectric material of the second component absent an electrically conductive material.

[0086] Arrangement-212: The device of any of Arrangements-208 to 211, wherein: the dielectric material of the second component comprises a glass-reinforced epoxy laminate material.

[0087] Arrangement-2l3: The device of any of Arrangements-20l to 212, wherein: the recessed portion of the first region comprises a dielectric material that is other than air.

[0088] Arrangement-214: The device of any of Arrangements-20l to 213, wherein: the recessed portion of the first region is open ended.

[0089] Arrangement-2l5: The device of any of Arrangements-20l to 213, wherein: the recessed portion of the first region is closed ended.

[0090] Arrangement-216: The device of any of Arrangements-20l to 215, wherein: the at least one EM antenna is disposed on the electrically conductive upper side of the first component.

[0091] Arrangement-301 : A method of making a device for an electromagnetic, EM, application, the method comprising: providing a dielectric component having a defined overall thickness t, a lower side, an upper side, a first region having a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion, and a second region having a plurality of cavities with side walls that extend completely through the thickness t; and coating the lower and upper sides of the dielectric component and the side walls of the plurality of cavities with an electrically conductive material, such that the upper side is electrically connected to the lower side via the side walls of the plurality of cavities of the second region.

[0092] Arrangement-302: The method of Arrangement-301, wherein: the providing comprises molding the dielectric component.

[0093] Arrangement-303: The method of Arrangement-302, wherein: the molding comprises injection molding.

[0094] Arrangement-304: The method of Arrangement-301, wherein: the providing comprises providing a dielectric substrate having the defined overall thickness t, the lower side, and the upper side, and removing material from the dielectric substrate to form the recessed portion in the first region and the plurality of cavities in the second region, to provide the dielectric component.

[0095] Arrangement-305: The method of any of Arrangements-30l to 304, wherein: the providing further comprises providing at least one via that extends completely through the thickness t; and further comprising: substantially filling the at least one via with an electrically conductive material, such that the vias electrically connect the lower and upper sides.

[0096] Arrangement-306: The method of any of Arrangements-30l to 305, wherein: the coating further comprises coating the ceiling and side walls of the recessed portion with an electrically conductive material, such that the ceiling of the recessed portion is electrically connected to the lower side via the side walls.

[0097] Arrangement-307: The method of any of Arrangements-30l to 306, wherein: the recessed portion of the first region is open ended.

[0098] Arrangement-308: The method of any of Arrangements-30l to 306, wherein: the recessed portion of the first region is closed ended.

[0099] Arrangement-401 : A method of making a device for an electromagnetic, EM, application, the method comprising: providing a two-sided metal clad dielectric substrate having a defined overall thickness t, a lower electrically conductive side, an upper electrically conductive side, a first region, and a second region; forming in the first region a recessed portion extending from the lower side toward the upper side with a recess dimension d that is less than t that forms a ceiling and side walls of the recessed portion; forming in the second region a plurality of cavities with side walls that extend completely through the thickness t; and coating the side walls of the plurality of cavities with an electrically conductive material, such that the upper side is electrically connected to the lower side via the side walls of the plurality of cavities of the second region. [0100] Arrangement-402: The method of Arrangement-401, further comprising: forming at least one via that extends completely through the thickness t; and substantially filling the at least one via with an electrically conductive material, such that the vias electrically connect the lower and upper sides.

[0101] Arrangement-403: The method of any of Arrangements-40l to 402, wherein: the forming in the first region the recessed portion comprises removing material from the two-sided metal clad dielectric substrate; and the forming in the second region the plurality of cavities comprises removing material from the two-sided metal clad dielectric substrate.

[0102] Arrangement-404: The method of any of Arrangements-40l to 403, wherein: the coating further comprises coating the ceiling and side walls of the recessed portion with an electrically conductive material, such that the ceiling of the recessed portion is electrically connected to the lower side via the side walls.

[0103] Analytical modeling was performed using a 4-by-4 array of DRAs with EM reflectors and a shielded dielectric channel as disclosed herein and depicted in FIG. 2.

Results of the analytical modeling demonstrated a 15+ dBi gain over a frequency range of 37 GHz to 40 GHz, with a bore sight gain of over 17 dBi. Results of the analytical modeling also demonstrated that the inclusion of a shielded dielectric channel strategically disposed over the EM signal feed (EM launch area) as disclosed herein, resulted in a gain of about 1.2- 1.3 dBi as compared to a similar antenna array absent such shielded dielectric channel.

While not being held to any particular theory, it is contemplated that the shielded dielectric channel serves to reduce the effect of negative reflections attributed to the presence of the EM reflectors surrounding the DRAs.

[0104] While an invention has been described herein with reference to example embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the claims. Many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof.

Therefore, it is intended that the invention not be limited to the particular embodiment or embodiments disclosed herein as the best or only mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. In the drawings and the description, there have been disclosed example embodiments and, although specific terms and/or dimensions may have been employed, they are unless otherwise stated used in a generic, exemplary and/or descriptive sense only and not for purposes of limitation, the scope of the claims therefore not being so limited. When an element such as a layer, film, region, substrate, or other described feature is referred to as being“on” another element, it can be directly on the other element, or intervening elements may also be present. In contrast, when an element is referred to as being“directly on” another element, there are no intervening elements present. The use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another. The use of the terms a, an, etc. do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. The term“comprising” as used herein does not exclude the possible inclusion of one or more additional features. And, any background information provided herein is provided to reveal information believed by the applicant to be of possible relevance to the invention disclosed herein. No admission is necessarily intended, nor should be construed, that any of such background information constitutes prior art against an embodiment of the invention disclosed herein.