ANTENNA-INTEGRATED COMMUNICATION MODULE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2017/047396

A1

According to the present invention, a multilayer substrate comprises a first dielectric layer and a conductor pattern that is arranged within and on the upper surface of the first dielectric layer; a second dielectric layer, which is formed of a material different from that of the first dielectric layer, is arranged on the multilayer substrate; the second dielectric layer is provided with at least one radiation element; a feeder line connects the radiation element and the conductor pattern with each other; the feeder line comprises an electrically conductive conductor pin that extends in the thickness direction of the second dielectric layer; and the conductor pin electrically connects the radiation element and the conductor pattern arranged on the upper surface of the first dielectric layer with each other. Consequently, the present invention provides an antenna-integrated communication module which is easy to enhance the accuracy in circuit simulation, while having a structure that has a high degree of freedom in selection of dielectric materials.

MIZUNUMA RYUKEN (JP)
BANBA SHINICHIRO (JP)
YOKOYAMA MICHIHARU (JP)
UEDA HIDEKI (JP)
YAMADA HIDEAKI (JP)
MORIOKA NOBORU (JP)

PCT/JP2016/075695

March 23, 2017

September 01, 2016

Click for automatic bibliography generation  

MURATA MANUFACTURING CO (JP)

H01L25/00; H01L23/12; H01Q1/38; H01Q3/26; H01Q23/00

JP2012514431A	2012-06-21
JP2004260786A	2004-09-16
JP2007124201A	2007-05-17

KITAYAMA, Mikio et al. (JP)

View/Download PDF      PDF Help

Previous Patent: ANTICANCER AGENT-ADSORPTIVE SHEET BODY

Next Patent: RECEIVING DEVICE, TRANSMITTING DEVICE, AND DATA PROCESSING METHOD