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Patent Searching and Data


Title:
ANTENNA MODULE AND CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2016/067969
Kind Code:
A1
Abstract:
Disclosed is an antenna module wherein an antenna configured from a conductor pattern is disposed on a dielectric substrate. A high frequency semiconductor element is mounted on the bottom surface of the dielectric substrate, said high frequency semiconductor element supplying the antenna with high frequency signals. A plurality of conductor columns are protruding from the bottom surface. The conductor columns are embedded in a dielectric member disposed on the bottom surface. Leading ends of the conductor columns are exposed from the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is provided in a side surface of a composite structure configured from the dielectric substrate and the dielectric member, and the side surface from the mounting surface to the step is retracted from the side surface above the step. The antenna module, which is not susceptible to generating variance in radiation characteristics of the antenna even in a state wherein the antenna is bonded by means of a bonding resin, is provided.

Inventors:
YOKOYAMA MICHIHARU (JP)
AMACHI NOBUMITSU (JP)
Application Number:
PCT/JP2015/079562
Publication Date:
May 06, 2016
Filing Date:
October 20, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q23/00; H01L23/28; H01Q1/24; H01Q21/06; H05K1/14
Foreign References:
JPH06104461A1994-04-15
JP2012195617A2012-10-11
JP2007013456A2007-01-18
JP2012517759A2012-08-02
JP2006067375A2006-03-09
Attorney, Agent or Firm:
KITAYAMA, Mikio et al. (JP)
Mikio Kiyama (JP)
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