ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME

Title:

ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME

Document Type and Number:

WIPO Patent Application WO/2022/169145

Kind Code:

A1

Abstract:

The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub. The short stub structure designed on a second layer different from the first layer having the open stub structure designed thereon may include a second via pad disposed to be adjacent to the via hole, a short stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot part configured to surround at least a portion of an edge of the second via pad, the short stub, and the transformer.

Inventors:

JEONG JUNGI (KR)
PARK CHANJU (KR)
OH JUNHWA (KR)
WI SANGHYUK (KR)

Application Number:

PCT/KR2022/001139

Publication Date:

August 11, 2022

Filing Date:

January 21, 2022

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H01Q1/28; H01Q1/24; H01Q1/38

Foreign References:

US20200344875A1	2020-10-29
US20110279190A1	2011-11-17
KR20150040592A	2015-04-15
US20180084637A1	2018-03-22
JP2011009505A	2011-01-13

Other References: