Title:
ANTENNA MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/186307
Kind Code:
A1
Abstract:
The present invention provides an antenna module package and a manufacturing method therefor, the antenna module package comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and an element which is coupled to the chip antenna and can perform an illumination function, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a sensor which is coupled to the chip antenna and recognizes a surrounding situation or is utilized to recognize the same, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a camera module which is coupled to the chip antenna and can photograph an object, in addition to the chip antenna's function.
Inventors:
NA HYUK HWI (KR)
HWANG HO SEOK (KR)
KIM YOUNG SEOK (KR)
PARK SEONG BEOM (KR)
AHN SANG HOON (KR)
KIM SUN HO (KR)
HWANG HO SEOK (KR)
KIM YOUNG SEOK (KR)
PARK SEONG BEOM (KR)
AHN SANG HOON (KR)
KIM SUN HO (KR)
Application Number:
PCT/KR2016/002905
Publication Date:
November 24, 2016
Filing Date:
March 23, 2016
Export Citation:
Assignee:
ITM SEMICONDUCTOR CO LTD (KR)
International Classes:
H01Q7/00; H01Q1/22; H05B37/02; H05K1/18
Foreign References:
KR20120006086A | 2012-01-17 | |||
KR101465441B1 | 2014-11-27 | |||
KR20150021419A | 2015-03-02 | |||
KR20140141636A | 2014-12-10 | |||
KR100694876B1 | 2007-03-13 |
Attorney, Agent or Firm:
KIM, Nam Sik et al. (KR)
김남식 (KR)
김남식 (KR)
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