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Patent Searching and Data


Title:
ANTENNA MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/186307
Kind Code:
A1
Abstract:
The present invention provides an antenna module package and a manufacturing method therefor, the antenna module package comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and an element which is coupled to the chip antenna and can perform an illumination function, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a sensor which is coupled to the chip antenna and recognizes a surrounding situation or is utilized to recognize the same, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a camera module which is coupled to the chip antenna and can photograph an object, in addition to the chip antenna's function.

Inventors:
NA HYUK HWI (KR)
HWANG HO SEOK (KR)
KIM YOUNG SEOK (KR)
PARK SEONG BEOM (KR)
AHN SANG HOON (KR)
KIM SUN HO (KR)
Application Number:
PCT/KR2016/002905
Publication Date:
November 24, 2016
Filing Date:
March 23, 2016
Export Citation:
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Assignee:
ITM SEMICONDUCTOR CO LTD (KR)
International Classes:
H01Q7/00; H01Q1/22; H05B37/02; H05K1/18
Foreign References:
KR20120006086A2012-01-17
KR101465441B12014-11-27
KR20150021419A2015-03-02
KR20140141636A2014-12-10
KR100694876B12007-03-13
Attorney, Agent or Firm:
KIM, Nam Sik et al. (KR)
김남식 (KR)
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