Title:
ANTENNA MODULE
Document Type and Number:
WIPO Patent Application WO/2023/199578
Kind Code:
A1
Abstract:
[Problem] To provide an antenna module having an electronic component such as an RFIC is built in. [Solution] An antenna module 100 comprising a core substrate C, an outermost insulating layer 10, and a resin layer 20 that is provided therebetween and has an RFIC 60 embedded therein. The core substrate C has: a core layer 40; insulating layers 30 and 50 that sandwich the core layer 40; conductor layers L3-L5 and an antenna layer L6; a through-hole conductor 70 that connects power-feed patterns F1, F2; a via conductor 71 that connects power-feed patterns F1, F3; and a via conductor 72 that connects an antenna pattern ANT and the power-feed pattern F2. The resin layer 20 has a conductor layer L2 connected to an RFIC 60. The thickness of the conductor layer L3 is thicker than the thickness of the conductor layer L2, and as a result, cracking and disconnection in the conductor layer L3 are made less likely to occur while causing the conductor layer L2 to have a fine pitch.
Inventors:
ABE TOSHIYUKI (JP)
TSUYUTANI KAZUTOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)
NISHIOKA HIROYUKI (JP)
ISHIKAWA NAOYUKI (JP)
TSUYUTANI KAZUTOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)
NISHIOKA HIROYUKI (JP)
ISHIKAWA NAOYUKI (JP)
Application Number:
PCT/JP2023/003698
Publication Date:
October 19, 2023
Filing Date:
February 06, 2023
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01Q1/24; H05K3/46; H01Q13/08; H01Q23/00
Domestic Patent References:
| WO2010134511A1 | 2010-11-25 | |||
| WO2013084496A1 | 2013-06-13 | |||
| WO2019054063A1 | 2019-03-21 |
Foreign References:
| JP2015213199A | 2015-11-26 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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