Title:
ANTENNA SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/137619
Kind Code:
A1
Abstract:
This antenna substrate comprises: an antenna; a power supply pattern; a core layer; a connection layer; an upper build-up part; and a lower build-up part. The power supply pattern is electrically connected to the antenna. The core layer includes a first reinforcement material and a first base material, and has a first surface and a second surface on the opposite side to the first surface. The connection layer includes a second reinforcement material and a second base material, and is disposed to face the first surface. The upper build-up part has at least one first non-reinforced layer which does not contain a reinforcement material, and is disposed between the core layer and a reinforcement layer. The lower build-up part has at least one second non-reinforced layer which does not contain a reinforcement material, and is disposed so as to face the second surface.
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Inventors:
TOMITA MICHIKAZU (JP)
Application Number:
PCT/JP2021/027510
Publication Date:
June 30, 2022
Filing Date:
July 26, 2021
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
H01Q1/38; H05K1/02; H05K3/46
Domestic Patent References:
| WO2018030544A1 | 2018-02-15 |
Foreign References:
| JP2020088318A | 2020-06-04 | |||
| JP2016152325A | 2016-08-22 | |||
| JP2020202248A | 2020-12-17 | |||
| JP2014029914A | 2014-02-13 | |||
| JP2009260335A | 2009-11-05 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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