Title:
ANTI-REFLECTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/070301
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an anti-reflective material that has sufficient anti-reflective function, has high thermal shock resistance, and can prevent reductions in the total luminous flux of a light source; and an optical semiconductor device in which an optical semiconductor element is sealed with the anti-reflective material. The present invention provides an anti-reflective material that comprises a cured product of a resin composition in which a porous filler (A) has been dispersed. The anti-reflective material is characterized in that the porous filler (A) forms, on the surface of the cured product, a relief that suppresses reflection. The anti-reflective material is also characterized in that the resin composition contains: a rubber-particle-dispersed epoxy compound (B) that comprises an alicyclic epoxy resin in which rubber particles have been dispersed; an acid-anhydride curing agent (C); and a curing accelerator (D). The anti-reflective material is also characterized in that the rubber particles: have a core-shell structure; comprise a polymer that includes, as an essential monomer component, a (meth)acrylate ester; have, on the surface thereof, as a functional group that can react with the alicyclic epoxy resin, a hydroxyl group and/or a carboxyl group; have an average particle size of 10–500 nm; and have a maximum particle size of 50–1000 nm. The anti-reflective material is also characterized in that the difference between the refractive index of the rubber particles and the refractive index of the cured product of the resin composition is within ±0.02. The anti-reflective material is also characterized in that the porous filler (A) is 4–40 weight% of the total amount (100 weight%) of the anti-reflective material. The present invention also provides an optical semiconductor device in which an optical semiconductor element is sealed with the anti-reflective material.
Inventors:
TAKABAYASHI NAOFUMI (JP)
Application Number:
PCT/JP2017/035961
Publication Date:
April 19, 2018
Filing Date:
October 03, 2017
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
G02B1/11; C08K3/00; C08L51/00; C08L63/00; G02B5/02; H01L23/29; H01L23/31; H01L33/54
Foreign References:
| JP2012151466A | 2012-08-09 | |||
| JP2014084332A | 2014-05-12 | |||
| JP2013203928A | 2013-10-07 | |||
| US20120235190A1 | 2012-09-20 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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