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Title:
ANTISTATIC RESIN COMPOSITION, RESIN FILM, AND BASE FILM FOR ANTISTATIC DICING TAPE
Document Type and Number:
WIPO Patent Application WO/2022/064949
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition that has adequate antistatic properties and that suppresses the inconvenience of an antistatic agent contaminating a metal roll of a film-forming machine during film formation, a resin film of said resin composition, and a base film for an antistatic dicing tape. To achieve this purpose, the present invention is a resin composition that includes 20-99 parts by mass of (A) an ethylene resin, 1-80 parts by mass of (B) a propylene resin, and 1-39 parts by mass of (C) a block copolymer of propylene and a polyhydric alcohol; the sum of the amount of the component (A) ethylene resin blended and the amount of the component (B) propylene resin blended is 100 parts by mass; and the component (B) propylene resin does not include a block copolymer of propylene and a polyhydric alcohol. The mass ratio of the amount of the component (B) propylene resin blended and the amount of the component (C) block copolymer of propylene and a polyhydric alcohol blended is preferably 0.4 or greater.

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Inventors:
SHINBO KOSUKE (JP)
SAITO KEN (JP)
Application Number:
PCT/JP2021/031337
Publication Date:
March 31, 2022
Filing Date:
August 26, 2021
Export Citation:
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Assignee:
RIKEN TECHNOS CORP (JP)
International Classes:
C08L23/04; C08L23/10; C08L23/16; C08L23/26; C08L53/00; H01L21/301
Foreign References:
JP2007253523A2007-10-04
JP2009143031A2009-07-02
JP2008069338A2008-03-27
JP2013241614A2013-12-05
JP2020084143A2020-06-04
JP2008274031A2008-11-13
JP2017214491A2017-12-07
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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