Title:
APPARATUS FOR ADHERING ADHESIVE TAPE, AND PRESSURE BONDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/084728
Kind Code:
A1
Abstract:
An ACF adhering apparatus takes a tape (20), wherein an ACF tape is laminated on a separator tape (20a), from a supply reel (22) having the tape (20) taken up thereon, and adheres the ACF tape onto the electrode of a substrate by pressing the tape (20) using a pressure bonding tool (18) so as to efficiently adhere the ACF and other adhesive tapes onto a plurality of required areas arranged in parallel on the substrate or to efficiently bond with pressure a material to be bonded. The ACF adhering apparatus is provided with a tape traveling route setting means (28), which arranges the diameter direction of the supply reel (22) to substantially orthogonally intersect the longitudinal direction of the pressure bonding tool (18), and makes the tape (20) taken from the supply reel (22) travel between the pressure bonding tool (18) and the substrate in the longitudinal direction of the pressure bonding tool (18) by means of a tape travel direction converting section (27a) provided at least on one area. Thus, the width direction of the pressure bonding tool (18) in the longitudinal direction is reduced.
Inventors:
MURAOKA, Nobuhiko (())
村岡信彦 (())
村岡信彦 (())
Application Number:
JP2010/000240
Publication Date:
July 29, 2010
Filing Date:
January 18, 2010
Export Citation:
Assignee:
Panasonic Corporation (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
MURAOKA, Nobuhiko (())
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
MURAOKA, Nobuhiko (())
International Classes:
H01L21/60; B65H37/04; H05K3/32
Attorney, Agent or Firm:
OGURI, Shohei et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F,7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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