Title:
APPARATUS FOR BONDING WORK PIECES, AND PRESS-CURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2012/098679
Kind Code:
A1
Abstract:
This apparatus for bonding work pieces uniformly pressurizes the whole board-like work pieces with a simple structure, irrespective of the size of the board-like work pieces. A plurality of pressing films (1) dispersedly disposed to face board-like work pieces (W) are deformed to protrude by means of pressure of a fluid, thereby, by means of leading edge portions (1a), pressing a pressure equalizing plate (2) in the direction, in which the board-like work pieces (W) are brought close to each other. Irrespective of whether or not a pressure equalizing plate (2) portion is a contact portion or non-contact portion with the leading edge portions (1a) of the pressing films (1), one whole board-like work piece (W) is pressurized in parallel by means of the smooth surface (2a) of the pressure equalizing plate using rigidity of the pressure equalizing plate (2), conforming to the shape of the other work piece (W) with a seal member (S) therebetween.
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Inventors:
OHTANI Yoshikazu (2-45, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
大谷 義和 (〒27 群馬県安中市磯部２丁目２番地４５号 信越エンジニアリング株式会社内 Gunma, 〒3790127, JP)
FUJITA Kazuya (2-45, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
藤田 一也 (〒27 群馬県安中市磯部２丁目２番地４５号 信越エンジニアリング株式会社内 Gunma, 〒3790127, JP)
大谷 義和 (〒27 群馬県安中市磯部２丁目２番地４５号 信越エンジニアリング株式会社内 Gunma, 〒3790127, JP)
FUJITA Kazuya (2-45, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
藤田 一也 (〒27 群馬県安中市磯部２丁目２番地４５号 信越エンジニアリング株式会社内 Gunma, 〒3790127, JP)
Application Number:
JP2011/051109
Publication Date:
July 26, 2012
Filing Date:
January 21, 2011
Export Citation:
Assignee:
SHIN-ETSU ENGINEERING CO., LTD. (9 Kanda Nishikicho 2-chome, Chiyoda-ku Tokyo, 54, 〒1010054, JP)
信越エンジニアリング株式会社 (〒54 東京都千代田区神田錦町２丁目９番地 Tokyo, 〒1010054, JP)
OHTANI Yoshikazu (2-45, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
大谷 義和 (〒27 群馬県安中市磯部２丁目２番地４５号 信越エンジニアリング株式会社内 Gunma, 〒3790127, JP)
FUJITA Kazuya (2-45, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
信越エンジニアリング株式会社 (〒54 東京都千代田区神田錦町２丁目９番地 Tokyo, 〒1010054, JP)
OHTANI Yoshikazu (2-45, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
大谷 義和 (〒27 群馬県安中市磯部２丁目２番地４５号 信越エンジニアリング株式会社内 Gunma, 〒3790127, JP)
FUJITA Kazuya (2-45, Isobe 2-chome, Annaka-sh, Gunma 27, 〒3790127, JP)
International Classes:
B30B15/34; G02F1/13; G09F9/00
Attorney, Agent or Firm:
EICHI Patent & Trademark Corp. (45-13, Sengoku 4-chome Bunkyo-k, Tokyo 11, 〒1120011, JP)
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Claims: