Title:
APPARATUS FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS, METHOD FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS, AND SYSTEM FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/100554
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an apparatus for cleaning a component of a semiconductor production apparatus, which is capable of preventing adhesion of a reaction product to the inside of a cleaning furnace, while having a simple structure. The present invention provides an apparatus (1) for cleaning a component of a semiconductor production apparatus, which is provided with: a cleaning furnace (2) which contains a component (10) of a semiconductor production apparatus; a heating device (3); a gas feed pipe (4); a gas discharge pipe (5); a pressure reduction device (6); a first temperature control device (7); a second temperature control device (8); and a purge gas supply mechanism (9).
More Like This:
| WO/2007/012884 | APPARATUS FOR HOLDING A ROLLER |
| JP2016060765 | INK COMPOSITION FOR PLASMA TREATMENT DETECTION AND PLASMA TREATMENT DETECTION INDICATOR |
| JPH03225825 | CLEANING |
Inventors:
YAMAGUCHI AKIRA (JP)
ARIMURA TADANOBU (JP)
ARIMURA TADANOBU (JP)
Application Number:
PCT/JP2019/041870
Publication Date:
May 22, 2020
Filing Date:
October 25, 2019
Export Citation:
Assignee:
TAIYO NIPPON SANSO CORP (JP)
International Classes:
B08B7/00; H01L21/205
Foreign References:
| JP2017168607A | 2017-09-21 | |||
| JP2010245376A | 2010-10-28 | |||
| JP2001515282A | 2001-09-18 | |||
| JP2011501429A | 2011-01-06 | |||
| JP2015192063A | 2015-11-02 | |||
| JPH1187326A | 1999-03-30 | |||
| JP2018041883A | 2018-03-15 | |||
| JP2013062342A | 2013-04-04 | |||
| JP2015073132A | 2015-04-16 |
Other References:
See also references of EP 3854492A4
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
Download PDF: