Title:
APPARATUS FOR COUPLING A MODULE CIRCUIT BOARD AND A FRAME TOGETHER, AND BACKLIGHT USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/150971
Kind Code:
A2
Abstract:
According to the present invention, an apparatus for coupling a module circuit board and a frame together comprises: a module circuit board on which light-emitting diodes are arranged into a predetermined pattern; and a frame coupled to the module circuit board by a coupling unit, wherein the coupling unit has coupling grooves formed at the back surface of the module circuit board, and coupling members formed at the frame to be coupled to the respective coupling grooves.
Inventors:
LEE JONG EUN (KR)
Application Number:
PCT/KR2010/002278
Publication Date:
December 29, 2010
Filing Date:
April 13, 2010
Export Citation:
Assignee:
LEE JONG EUN (KR)
International Classes:
G02F1/1345; G02F1/1333
Foreign References:
| JPS60216435A | 1985-10-29 |
Attorney, Agent or Firm:
LEE, Jea Ryang (621-15 Dochen-Dong Gwangsan-Gu, Gwangju 506-301, KR)
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