Title:
APPARATUS FOR CUTTING MIXED TAPE
Document Type and Number:
WIPO Patent Application WO/2021/040121
Kind Code:
A1
Abstract:
The present invention provides an apparatus for cutting a mixed tape in a state in which a protective film and an anisotropic conductive film are bonded to each other, the apparatus being technically characterized by comprising: a supply unit on which the mixed tape is wound; a force linear which slides from one side surface of the mixed tape to the other side surface thereof; and a cutting unit coupled to the force linear to cut only the anisotropic conductive film, wherein the amount of sliding movement of the force linear when a set value is reached is limited by a set pressure.
Inventors:
KIM MIN SOO (KR)
JUNG JIN MYUNG (KR)
JUNG JIN MYUNG (KR)
Application Number:
PCT/KR2019/012601
Publication Date:
March 04, 2021
Filing Date:
September 27, 2019
Export Citation:
Assignee:
DNA SYSTEM CO LTD (KR)
International Classes:
B65H35/06; B65H20/16; B65H41/00
Foreign References:
| KR101209502B1 | 2012-12-07 | |||
| JP2004082609A | 2004-03-18 | |||
| KR20050070713A | 2005-07-07 | |||
| KR101615581B1 | 2016-05-13 | |||
| JP3584153B2 | 2004-11-04 |
Attorney, Agent or Firm:
AHN, Jaeyul (KR)
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