CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 62/653886 filed on April 6, 2018, the content of which is relied upon and incorporated herein by reference in its entirety.

FIELD

[0002] The present disclosure relates generally to apparatus for heating molten material and, more particularly, to apparatus for heating molten material with electrodes.

BACKGROUND

[0003] It is known to heat material within the interior of a vessel to produce a quantity of molten material and heat the molten material to a predetermined temperature. Conventional techniques include heating the molten material by passing electricity through the molten material from the first electrode to the second electrode.

SUMMARY

[0004] The following presents a simplified summary of the disclosure to provide a basic understanding of some embodiments described in the detailed description.

[0005] In some example embodiments, an apparatus for heating molten material can comprise a vessel comprising a base wall and a side wall extending from the base wall. An inner surface of the base wall and an inner surface of the side wall can define a containment area of the vessel. The apparatus can further include a first electrode comprising a portion positioned within a first through opening of the side wall. The apparatus can also include a second electrode comprising a portion positioned within a second through opening of the side wall. A wall material can define a portion of the inner surface of the base wall and can comprise a resistivity at 60 Hz within a range from about 200 Ohms · cm to 625 Ohms · cm within a temperature range from 1500 °C to 1600 °C.

[0006] In further example embodiments, an apparatus for heating molten material can comprise a vessel comprising a base wall and a side wall extending from the base wall. An inner surface of the base wall and an inner surface of the side wall can define a containment area of the vessel. The apparatus can further include molten material positioned within the containment area. The apparatus can also include a first electrode comprising a portion positioned within a first through opening of the side wall. An outer end of the first electrode can contact the molten material. The apparatus can still also include a second electrode comprising a portion positioned within a second through opening of the side wall. An outer end of the second electrode can also contact the molten material. A wall material can define a portion of the inner surface of the base wall. A 1600 °C resistivity ratio between the wall material and the molten material is within a range from about 1.0 to about 3.0.

[0007] In some embodiments, the wall material can comprise a resistivity at 60 Hz within a range from about 200 Ohms · cm to 625 Ohms · cm within a temperature range from 1500 °C to 1600 °C.

[0008] In some embodiments, the wall material can define an inner surface of an unbroken path connecting the first through opening with the second through opening.

[0009] In some embodiments, the side wall can comprise a side wall portion elevationally defined between an elevation of the base wall and an elevation of a lower periphery of the first through opening.

[0010] In some embodiments, the apparatus can further comprise a cooling device contacting an outer surface of the side wall portion.

[0011] In some embodiments, the cooling device can comprise a plate.

[0012] In some embodiments, the apparatus can further comprise a rod positioned to force the plate in a direction towards the outer surface of the side wall portion.

[0013] In some embodiments, the apparatus can further comprise a pad positioned between the rod and the plate to increase an electrical resistance between the rod and the plate.

[0014] In some further embodiments, an apparatus for heating molten material can comprise a vessel comprising a base wall and a side wall extending from the base wall. An inner surface of the base wall and an inner surface of the side wall can define a containment area of the vessel. The apparatus can further comprise a first electrode comprising a portion positioned within a first through opening of the side wall. The apparatus can still further comprise a second electrode comprising a portion positioned within a second through opening of the side wall. The side wall can comprise a side wall portion elevationally defined between an elevation of the base wall and an elevation of a lower periphery of the first through opening. The apparatus can further comprise a cooling device contacting an outer surface of the side wall portion.

[0015] In some embodiments, the cooling device can comprise a plate.

[0016] In some embodiments, the apparatus can further comprise a rod positioned to force the plate in a direction towards the outer surface of the side wall portion.

[0017] In some embodiments, the apparatus can further comprise a pad positioned between the rod and the plate to increase an electrical resistance between the rod and the plate.

[0018] In some embodiments, the wall material defines an inner surface of an unbroken path connecting the first through opening with the second through opening.

[0019] In some embodiments, methods of heating molten material with embodiments of the apparatus above can comprise heating molten material within the containment area by passing electricity through the molten material from the first electrode to the second electrode. The method can further comprise cooling the side wall portion with targeted enhanced cooling of the side wall portion of the side wall with the cooling device.

[0020] In some embodiments of the method, the cooling of the side wall portion can be targeted vertically below a lower periphery of the first through opening with the cooling device.

[0021] In some embodiments of the method, the side wall portion can be cooled by circulating fluid with the cooling device.

[0022] In some embodiments of the method, a cooling plate of the cooling device can be forced in a direction toward the side wall portion.

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] These and other features, embodiments and advantages are better understood when the following detailed description is read with reference to the accompanying drawings, in which:

[0024] FIG. 1 schematically illustrates an exemplary embodiment of a glass manufacturing apparatus in accordance with embodiments of the disclosure; [0025] FIG. 2 shows a perspective cross-sectional view of the glass manufacturing apparatus along line 2-2 of FIG. 1 in accordance with embodiments of the disclosure;

[0026] FIG. 3 shows a schematic view of a portion of the glass manufacturing apparatus along line 3-3 of FIG. 1 in accordance with embodiments of the disclosure;

[0027] FIG. 4 shows a schematic cross-sectional view of the glass manufacturing apparatus along line 4-4 of FIG. 3 in accordance with embodiments of the disclosure;

[0028] FIG. 5 shows an enlarged portion of the cross-sectional view of the glass manufacturing apparatus taken at view 5A of FIG. 4, wherein the enlarged portion of the cross-sectional view of the glass manufacturing apparatus taken at view 5B of FIG. 4 can comprise a mirror image of FIG. 5;

[0029] FIG. 6 shows a partial cross-sectional view of the glass manufacturing apparatus taken along line 6-6 of FIG. 5; and

[0030] FIG. 7 shows a partial cross-sectional view of the glass manufacturing apparatus taken along line 7-7 of FIG. 5.

DETAILED DESCRIPTION

[0031] Embodiments will now be described more fully hereinafter with reference to the accompanying drawings in which example embodiments are shown. Whenever possible, the same reference numerals are used throughout the drawings to refer to the same or like parts. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0032] It is to be understood that specific embodiments disclosed herein are intended to be exemplary and therefore non-limiting. For purposes of the disclosure, in some embodiments, a glass manufacturing apparatus can optionally include a glass forming apparatus that forms a glass article (e.g., a glass ribbon and/or a glass sheet) from a quantity of molten material. For instance, in some embodiments, the glass manufacturing apparatus can optionally comprise a glass forming apparatus such as a slot draw apparatus, float bath apparatus, down-draw apparatus, up-draw apparatus, press-rolling apparatus, or other glass forming apparatus that forms a glass article. In some embodiments, the glass article can be employed in a variety of articles having desired optical characteristics (e.g., ophthalmic articles, display articles). For instance, in some embodiments, the apparatus can be employed to produce display articles (e.g., display glass sheets) that may be used in a wide variety of display applications including, but not limited to, liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), and other electronic displays.

[0033] As schematically illustrated in FIG. 1, in some embodiments, an exemplary glass manufacturing apparatus 100 can include a glass forming apparatus 101 including a forming vessel 140 designed to produce a glass ribbon 103 from a quantity of molten material 121. In some embodiments, the glass ribbon 103 can include a central portion 152 disposed between opposite, relatively thick edge beads formed along a first outer edge 153 and a second outer edge 155 of the glass ribbon 103. Additionally, in some embodiments, a glass sheet 104 can be separated from the glass ribbon 103 along a separation path 151 by a glass separator 149 (e.g., scribe, score wheel, diamond tip, laser, etc.). In some embodiments, before or after separation of the glass sheet 104 from the glass ribbon 103, the relatively thick edge beads formed along the first outer edge 153 and the second outer edge 155 can be removed to provide the central portion 152 as a high-quality glass sheet 104 having a uniform thickness. In some embodiments, the resulting high-quality glass sheet 104 can then be one of processed and employed in a variety of applications.

[0034] In some embodiments, the glass manufacturing apparatus 100 can include a melting vessel 105 oriented to receive batch material 107 from a storage bin 109. The batch material 107 can be introduced by a batch delivery device 111 powered by a motor 113. In some embodiments, an optional controller 115 can be operated to activate the motor 113 to introduce a desired amount of batch material 107 into the melting vessel 105, as indicated by arrow 117. The melting vessel 105 can heat the batch material 107 to provide molten material 121. In some embodiments, a glass melt probe 119 can be employed to measure a level of molten material 121 within a standpipe 123 and communicate the measured information to the controller 115 by way of a communication line 125. [0035] Additionally, in some embodiments, the glass manufacturing apparatus 100 can include a first conditioning station including a fining vessel 127 located downstream from the melting vessel 105 and coupled to the melting vessel 105 by way of a first connecting conduit 129. In some embodiments, molten material 121 can be gravity fed from the melting vessel 105 to the fining vessel 127 by way of the first connecting conduit 129. For example, in some embodiments, gravity can drive the molten material 121 to pass through an interior pathway of the first connecting conduit 129 from the melting vessel 105 to the fining vessel 127. Additionally, in some embodiments, bubbles can be removed from the molten material 121 within the fining vessel 127 by various techniques.

[0036] In some embodiments, the glass manufacturing apparatus 100 can further include a second conditioning station including a mixing chamber 131 that can be located downstream from the fining vessel 127. The mixing chamber 131 can be employed to provide a homogenous composition of molten material 121, thereby reducing or eliminating inhomogeneity that may otherwise exist within the molten material 121 exiting the fining vessel 127. As shown, the fining vessel 127 can be coupled to the mixing chamber 131 by way of a second connecting conduit 135. In some embodiments, molten material 121 can be gravity fed from the fining vessel 127 to the mixing chamber 131 by way of the second connecting conduit 135. For example, in some embodiments, gravity can drive the molten material 121 to pass through an interior pathway of the second connecting conduit 135 from the fining vessel 127 to the mixing chamber 131.

[0037] Additionally, in some embodiments, the glass manufacturing apparatus 100 can include a third conditioning station including a delivery vessel 133 that can be located downstream from the mixing chamber 131. In some embodiments, the delivery vessel 133 can condition the molten material 121 to be fed into an inlet conduit 141. For example, the delivery vessel 133 can function as an accumulator and/or flow controller to adjust and provide a consistent flow of molten material 121 to the inlet conduit 141. As shown, the mixing chamber 131 can be coupled to the delivery vessel 133 by way of a third connecting conduit 137. In some embodiments, molten material 121 can be gravity fed from the mixing chamber 131 to the delivery vessel 133 by way of the third connecting conduit 137. For example, in some embodiments, gravity can drive the molten material 121 to pass through an interior pathway of the third connecting conduit 137 from the mixing chamber 131 to the delivery vessel 133. As further illustrated, in some embodiments, a delivery pipe 139 (e.g., downcomer) can be positioned to deliver molten material 121 to the inlet conduit 141 of the forming vessel 140.

[0038] Various embodiments of forming vessels can be provided in accordance with features of the disclosure including a forming vessel with a wedge for fusion drawing the glass ribbon, a forming vessel with a slot to slot draw the glass ribbon, or a forming vessel provided with press rolls to press roll the glass ribbon from the forming vessel. By way of illustration, the forming vessel 140 shown and disclosed below can be provided to fusion draw molten material 121 off a root 145 of a forming wedge 209 to produce the glass ribbon 103. For example, in some embodiments, the molten material 121 can be delivered from the inlet conduit 141 to the forming vessel 140. The molten material 121 can then be formed into the glass ribbon 103 based on the structure of the forming vessel 140. For example, as shown, the molten material 121 can be drawn off the bottom edge (e.g., root 145) of the forming vessel 140 along a draw path extending in a draw direction 157 of the glass manufacturing apparatus 100. In some embodiments, edge directors 163a, 163b can direct the molten material 121 off the forming vessel 140 and define a width“WR” of the glass ribbon 103. In some embodiments, the width“WR” of the glass ribbon 103 can extend between the first outer edge 153 of the glass ribbon 103 and the second outer edge 155 of the glass ribbon 103.

[0039] FIG. 2 shows a cross-sectional perspective view of the glass manufacturing apparatus 100 along line 2-2 of FIG. 1. In some embodiments, the forming vessel 140 can include a trough 201 oriented to receive the molten material 121 from the inlet conduit 141. For illustrative purposes, cross-hatching of the molten material 121 is removed from FIG. 2 for clarity. The forming vessel 140 can further include the forming wedge 209 including a pair of downwardly inclined converging surface portions 207a, 207b extending between opposed ends 210a, 210b (See FIG. 1) of the forming wedge 209. The pair of downwardly inclined converging surface portions 207a, 207b of the forming wedge 209 can converge along the draw direction 157 to intersect along a bottom edge of the forming wedge 209 to define the root 145 of the forming vessel 140. A draw plane 213 of the glass manufacturing apparatus 100 can extend through the root 145 along the draw direction 157. In some embodiments, the glass ribbon 103 can be drawn in the draw direction 157 along the draw plane 213. As shown, the draw plane 213 can bisect the root 145 although, in some embodiments, the draw plane 213 can extend at other orientations relative to the root 145.

[0040] Additionally, in some embodiments, the molten material 121 can flow in a direction 159 into the trough 201 of the forming vessel 140. The molten material 121 can then overflow from the trough 201 by simultaneously flowing over corresponding weirs 203a, 203b and downward over the outer surfaces 205a, 205b of the corresponding weirs 203a, 203b. Respective streams of molten material 121 can then flow along the downwardly inclined converging surface portions 207a, 207b of the forming wedge 209 to be drawn off the root 145 of the forming vessel 140, where the flows converge and fuse into the glass ribbon 103. The glass ribbon 103 can then be fusion drawn off the root 145 in the draw plane 213 along the draw direction 157. In some embodiments, the glass separator 149 (see FIG. 1) can then subsequently separate the glass sheet 104 from the glass ribbon 103 along the separation path 151. As illustrated, in some embodiments, the separation path 151 can extend along the width“WR” of the glass ribbon 103 between the first outer edge 153 and the second outer edge 155. Additionally, in some embodiments, the separation path 151 can extend substantially perpendicular to the draw direction 157 of the glass ribbon 103. Moreover, in some embodiments, the draw direction 157 can be a fusion draw direction of the glass ribbon 103 being fusion drawn from the forming vessel 140.

[0041] As shown in FIG. 2, the glass ribbon 103 can be drawn from the root 145 with a first major surface 215a of the glass ribbon 103 and a second major surface 215b of the glass ribbon 103 facing opposite directions and defining a thickness“T” (e.g., average thickness) of the glass ribbon 103. In some embodiments, the thickness “T’ of the glass ribbon 103 can be less than or equal to about 2 millimeters (mm), less than or equal to about 1 millimeter, less than or equal to about 0.5 millimeters, less than or equal to about 500 micrometers (pm), for example, less than or equal to about 300 pm, less than or equal to about 200 pm, or less than or equal to about 100 pm, although other thicknesses may be provided in further embodiments. For example, in some embodiments, the thickness“Ί” of the glass ribbon 103 can be from about 50 mih to about 750 mih, from about 100 mih to about 700 mih, from about 200 mih to about 600 mih, from about 300 mih to about 500 mih, from about 50 mih to about 500 mih, from about 50 mih to about 700 mih, from about 50 mih to about 600 mih, from about 50 mih to about 500 mm, from about 50 mih to about 400 mih, from about 50 mih to about 300 mih, from about 50 mm to about 200 mih, from about 50 mih to about 100 mih, including all ranges and subranges of thicknesses therebetween. In addition, the glass ribbon 103 can include a variety of compositions including, but not limited to, soda-lime glass, borosilicate glass, alumino-borosilicate glass, alkali-containing glass or alkali-free glass.

[0042] FIGS. 3-7 show an embodiment of a heating apparatus 300 for heating molten material 121. The heating apparatus 300 can include a vessel including a containment area for containing molten material. The heating apparatus 300 may be applied to various vessels in the glass manufacturing apparatus 100. For instance, the heating apparatus 300 can be employed to vessels that can process material in a wide range of ways including but not limited to fining, conditioning, containing, stirring, chemically reacting, bubbling a gas therein, cooling, heating, forming, holding and flowing.

[0043] In some embodiments, with respect to the glass manufacturing apparatus 100 of FIG. 1, the heating apparatus 300 can include a vessel that comprises, but is not limited to, the melting vessel 105, first connecting conduit 129, fining vessel 127, the standpipe 123, the second connecting conduit 135, the mixing chamber 131, the third connecting conduit 137, the delivery vessel 133, the delivery pipe 139, the inlet conduit 141 and the forming vessel 140.

[0044] As shown in FIGS. 3-7, by way of example, the heating apparatus 300 comprises the melting vessel 105 including a base wall 313 and a side wall 310 extending from the base wall 313. The base wall 313 connects to the bottom of the side wall 310 to form a containment area 315. The base wall 313 and side wall 310 can be formed from bricks of refractory material that can contain molten material at high temperatures. In the illustrated embodiment, the side wall 310 can include a rectangular (e.g., square) shape as viewed from the top shown in FIG. 3 although other shapes may be provided. Indeed, as shown in FIG. 3, the side wall 310 can include four side wall segments arranged in a rectangular (e.g., square) shape. Although four side wall segments are shown, it will be understood that a single side wall segment may be provided in further embodiments. For example, the side wall can comprise a single side wall segment that has a curvilinear shape (e.g., elliptical, oblong, circular). Furthermore, although four side wall segments are illustrated, three or more than four side wall segments may be provided in further embodiments.

[0045] FIG. 3 shows a plan view of a portion of the glass manufacturing apparatus 100 including the melting vessel 105 along line 3-3 of FIG. 1, with a top portion (e.g., lid, roof, ceiling) of the melting vessel 105 removed for clarity. Thus, unless otherwise noted, it is to be understood that, in some embodiments, the melting vessel 105 can include a fixed or removable top portion without departing from the scope of the disclosure. Additionally, unless otherwise noted, in some embodiments, the top portion of the melting vessel 105 can be open to, for example, the environment outside of the melting vessel 105, and a free surface of the molten material 121 can face the open top portion.

[0046] As shown in FIG. 4, in some embodiments, an inner surface 311 of the side wall 310 and an inner surface 312 of the base wall 313 can define a containment area 315 of the vessel. The containment area 315 can include a wide range of three- dimensional shapes such as, but not limited to, a sphere, a rectangular box, a cylinder, a cone, or other three-dimensional shape oriented to provide the containment area 315. Exemplary embodiments of an exemplary heating apparatus 300 discussed above have been described with respect to heating molten material 121 contained within the containment area 315 of the melting vessel 105 with the understanding that, unless otherwise noted, one or more features of the heating apparatus 300 can be employed, alone or in combination, in some embodiments, to heat material contained within a containment area of other vessels of the glass manufacturing apparatus 100. As shown, in some embodiments, the containment area 315 can contain material (e.g., batch material 107, molten material 121); however, unless otherwise noted, it is to be understood that the melting vessel 105 can be empty (e.g., provided without material) in some embodiments, without departing from the scope of the disclosure.

[0047] In some embodiments, the side wall 310 of the melting vessel 105 can include (e.g., be manufactured from) metallic and/or non-metallic materials including but not limited to one or more of a thermal insulating refractory material (e.g., ceramic, silicon carbide, zirconia, zircon, chromium oxide). Additionally, as shown in FIG. 5, in some embodiments, a portion of the inner surface 311, 312 of the melting vessel 105 can be defined by a wall material 501 of the side wall 310 and the base wall 313 to provide the containment area 315 with a corrosion resistant barrier for the material 107, 121 contained within the containment area 315. In some embodiments, the side wall 310 and base wall 313 of the melting vessel 105 can include material selected to resist structural degradation and deformation (e.g., warp, sag, creep, fatigue, corrosion, breakage, cracking, thermal shock, structural shock, etc.) caused by exposure to one or more of an elevated temperature (e.g., temperatures at or below 2l00°C), a corrosive chemical (e.g., boron, phosphorus, sodium oxide), and an external force. In some embodiments, the side wall 310 and/or base wall 313 can be manufactured as a solid monolithic structure; however, in some embodiments, a plurality of separate structures (e.g., bricks) can be combined (e.g., stacked, placed) to provide a portion of the side wall 310 and/or a portion of the base wall 313. For purposes of the disclosure, irrespective of the way the side wall 310 and base wall 313 are constructed, a containment vessel can be provided with inner surface 311, 312 defining a portion of a containment area 315 oriented to contain material 107, 121 within the containment area 315.

[0048] In some embodiments, the heating apparatus 300 for heating molten material that can include a first electrode 301 and a second electrode 302 operable to heat (e.g., melt) the batch material 107 to provide molten material 121 and/or to heat molten material 121 contained within the containment area 315. In some embodiments, the first electrode 301 and the second electrode 302 can be identical to one another. As such, discussion throughout the disclosure features of the first electrode 301 can be identical to features of the second electrode 302. In further embodiments, structures associated and/or operable with the first electrode 301 can be identical to structures associated and/or operable with the second electrode 302. As such, discussion throughout the disclosure of the features of the first electrode 301 and structures associated and/or operable with the first electrode 301 can equally apply to the features of the second electrode 302 and structures associated and/or operable with the second electrode 302. Furthermore, although not shown, features of the second electrode 302 and/or structures associated and/or operable with the second electrode 302 may not be identical to corresponding features of the first electrode 301 and/or corresponding structures associated with the first electrode 301.

[0049] As shown in FIG. 4, the first electrode 301 can include a portion positioned within a first through opening 401 of the side wall 310. As shown, a front face 303 of an outer end of the first electrode 301 can contact molten material 121 contained within the containment area 315. As further illustrated, the second electrode 302 can include a portion positioned within a second through opening 402 of the side wall 310. A front face 304 of an outer end of the second electrode 302 can also contact molten material 121 contained within the containment area 315.

[0050] In some embodiments, a heating electrical circuit including a first electrical lead 307 electrically connected to the first electrode 301 and a second electrical lead 308 electrically connected to the second electrode 302. In some embodiments, the material (e.g., batch material 107, molten material 121) can include material properties that cause the material to behave as an electrical resistor which converts an electric current 325 passing through the material 107, 121 into heat energy based on the principle of Joule heating. Accordingly, in some embodiments, the Joule heating can be based on the Joule law (P = I ² x R), where“P” is the electrical heating power,“I” is the electric current 325, and“R” is the electrical resistivity of the material through which the electric current 325 passes. For example, in some embodiments, electric current 325 can pass from the front face 303 of the first electrode 301, through the material 107, 121 contained in the containment area 315, to the front face 304 of the second electrode 302. Likewise, in some embodiments, electric current 325 can pass from the front face 304 of the second electrode 302, through the material 107, 121 contained in the containment area 315, to the front face 303 of the first electrode 301. Accordingly, in some embodiments, based on the conversion of the electric current 325 into heat energy, one or more features of the heating apparatus 300 can operate to increase a temperature of the material 107, 121 and/or maintain a temperature of the material 107, 121 contained within the containment area 315.

[0051] In some embodiments, based on the heat energy provided by electric current 325, a temperature of a rear face 305 of the first electrode 301 can be less than a temperature of the front face 303 of the first electrode 301. Likewise, in some embodiments, based on the heat energy provided by electric current 325, a temperature of a rear face 306 of the second electrode 302 can be less than a temperature of the front face 304 of the second electrode 302. In some embodiments, a cooling device (e.g., cooling plate) may be placed in contact with the rear face 305, 306 of each electrode 301, 302 to help cool the electrode. Cooling the electrode can help reduce the wear rate of the electrode. Furthermore, cooling of the rear face of the electrode can help prevent electrically connections between a heating circuit and the electrodes from overheating.

[0052] Each through opening 401, 402 can extend entirely through the side wall 310 to allow each electrode 301, 302 to be inserted through the wall and translated in corresponding inward directions 351, 352. As shown, each opening 401, 402 can extend through opposite side wall segments of four side wall segments of the side wall 310. In embodiments with a single sidewall or other shaped sidewall, the each opening 401, 402 can optionally be provided on opposite portions of the side wall. As shown, in some embodiments, the first through opening 401 and the second through opening 402 can be aligned along a common axis. As further shown, in some embodiments, the front face 303 of the first electrode 301 can face the front face 304 of the second electrode 302 with the front faces 303, 304 contacting the material 107, 121 contained within the containment area 315 of the melting vessel 105. Accordingly, in some embodiments, electric current 325 can pass from the front face 303 of the first electrode 301 positioned in the first opening 401 through the material 107, 121 contained in the containment area 315, to the front face 304 of the second electrode 302 positioned in the second opening 402. Likewise, in some embodiments, electric current 325 can pass from the front face 304 of the second electrode 302 positioned in the second opening 402, through the material 107, 121 contained in the containment area 315, to the front face 303 of the first electrode 301 positioned in the first opening 401.

[0053] In some embodiments, one of the front face 303 of the first electrode 301 and the front face 304 of the second electrode 302 can wear, for example, over a duration of time based on operation of the heating apparatus 300 and contact with the material 107, 121. In some embodiments, the first electrode 301 can be adjusted relative to the first opening 401 to translate the front face 303 along an adjustment path in the inward direction 351, thereby compensating for the structural degradation of the front face 303 caused by wear while operating the glass manufacturing apparatus 100. Likewise, in some embodiments, the second electrode 302 can be adjusted relative to the second opening 404 to translate the front face 304 along an adjustment path in the inward direction 352, thereby compensating for the structural degradation of the front face 304 caused by wear while operating the glass manufacturing apparatus 100. In some embodiments, the inner surface 311, 312 of the side wall 310 and base wall 313 as well as the front face 303 of the first electrode 301 and the front face 304 of the second electrode 302 can define the containment area 315 of the melting vessel 105.

[0054] In some embodiments, the first electrode 301 and/or the second electrode 302 can include (e.g., be manufactured from) metallic and/or non-metallic materials including but not limited to one or more of tin oxide, carbon, zirconia, molybdenum, platinum, and platinum alloys. As discussed previously, in some embodiments, the front face 303 of the outer end of the first electrode 301 and the front face 304 of the outer end of the second electrode 302 can contact the material 107, 121 contained within the containment area 315 of the melting vessel 105. Accordingly, in some embodiments, the first electrode 301 and/or the second electrode 302 can include material selected to resist structural degradation and deformation (e.g., warp, sag, creep, fatigue, corrosion, breakage, cracking, thermal shock, structural shock, etc.) caused by exposure to one or more of an elevated temperature (e.g., temperatures at or below 2l00°C), a corrosive chemical (e.g., boron, phosphorus, sodium oxide), and an external force. Moreover, in some embodiments, the first electrode 301 and/or the second electrode 302 can be manufactured as a single monolithic structure; however, in some embodiments, a plurality of separate structures (e.g., bricks) can be combined (e.g., stacked) to provide a portion of the first electrode 301 and/or the second electrode 302. Building the electrode from a plurality of separate structures (e.g., bricks) can help simplify and reduce costs of fabrication of the electrode.

[0055] In some embodiments, one or more further heating devices (not shown) can be provided to, for example, initially melt the batch material 107 to provide the molten material 121 contained within the containment area 315, and then the heating apparatus 300 can be employed to further melt the batch material 107 and/or further heat the molten material 121. Moreover, in some embodiments one or more additional heating devices (not shown) including but not limited to gas heaters, electric heaters, and resistance heaters can be provided to provide additional heat to the material 107, 121 contained within the containment area 315 of the melting vessel 105 without departing from the scope of the disclosure.

[0056] In some embodiments, the heating apparatus 300 can, therefore, be employed to, for example, heat the material 107, 121 contained within the containment area 315 of the melting vessel 105. For example, as indicated by arrow 317, in some embodiments, the molten material 121 can flow through the containment area 315 to the first connecting conduit 129 (e.g., across the electric current 325) while being heated by the heating apparatus 300. In some embodiments, the molten material 121 can then be provided to the glass forming apparatus 101 for further processing to, for example, form the glass ribbon 103 (See FIG. 1).

[0057] In some embodiments, the heating apparatus 300 can be used to heat a wide range of molten material 121 including a wide range of resistivities. In some embodiments, example samples of molten material (Ml, M2, M3) can include resistivities at 1500 °C and 1600 °C with an alternating current of 60 Hertz (Hz) as set forth in Table 1 below (Ohms · centimeter).

Table 1

[0058] Thus, in some embodiments, the molten material can comprise a resistivity at 60 Hz within a range from about 127 (W·ah) to about 432 (W·ah) within a temperature range from 1500 °C and 1600 °C. For instance, example molten material Ml can include a resistivity at 60 Hz within a range from about 127 (W·ah) to about 330 (W·oih) within a temperature range from 1500 °C and 1600 °C. In another example, molten material M2 can include a resistivity at 60 Hz within a range from about 178 (W·oih) to about 406 (W·oih) within a temperature range from 1500 °C and 1600 °C. In another example, molten material M3 can include a resistivity at 60 Hz within a range from about 191 (W·oih) to about 432 (W·oih) within a temperature range from 1500 °C and 1600 °C. The example resistivities of the molten material 121 discussed above can be provided, in some embodiments, for molten material configured to be formed into a glass article such as the glass ribbon 103 illustrated in FIG. 1.

[0059] In some embodiments, the wall material can comprise a zirconia fused cast material. For instance, the wall material can comprise XiLEC 9 zirconia fused cast material available from Saint-Gobain SEFPRO with a typical chemical composition of 88.4% Zr0 ₂ , 9.0 % Si0 ₂ , 1% Ta ₂ 0 ₅ / Nb ₂ 0 ₅ , 0.7% B ₂ 0 ₃ , 0.5% Al ₂ 0 ₃ and others less than 0.3% (Ti0 ₂ +Fe ₂ 0 ₃ +Na ₂ 0+Y ₂ 0 ₃ ). The XiLEC 9 zirconia fused cast material can include 89.5% monoclinic zirconia and a 10.5% vitreous phase.

[0060] In further embodiments, the wall material can comprise XiLEC 5 zirconia fused cast material available from Saint-Gobain SEFPRO with a typical chemical composition of 92.6% Zr0 ₂ , 5.0 % Si0 ₂ , 1.1% Ta ₂ 0 ₅ / Nb ₂ 0 ₅ , 0.5% B ₂ 0 ₃ , 0.5% Al ₂ 0 ₃ and others less than 0.3% (Ti0 ₂ +Fe ₂ 0 ₃ +Na ₂ 0+Y ₂ 0 ₃ ). The XiLEC 5 zirconia fused cast material can include 93.5% monoclinic zirconia and a 6.5% vitreous phase.

[0061] Resistivities of XiLEC 5 (see X5 in Table 2 below) and XiLEC 9 (see X9 in Table 2 below) are known to include resistivities at 1500 °C and 1600 °C with an alternating current of 60 Hertz (Hz) as set forth in Table 2 below (Ohms · centimeter).

Table 2

[0062] Thus, in some embodiments, the wall material 501 can comprise a resistivity, at an alternating current of 60 Hz, within a range from about 200 (W·ah) to about 625 (Q ^» cm) within a temperature range from 1500 °C and 1600 °C. For instance, with respect to XiLEC 5 shown in Table 2 above, the resistivity at 60 Hz can be within a range from about 200 (W·ah) to about 350 (W·ah) within a temperature range from 1500 °C and 1600 °C. With respect to XiLEC 9 shown in Table 2 above, the resistivity at 60 Hz can be within a range from about 375 (W·ah) to about 625 (Q ^» cm) within a temperature range from 1500 °C and 1600 °C.

[0063] Table 3 below lists the resistivity ratio of the resistivities XiLEC 5 (X5) and XiLEC 9 (X9) listed in Table 2 relative to the samples of molten material (Ml, M2, M3) listed in Table 1 above.

Table 3

[0064] The wall material 501 can be selected such that a 1600 °C resistivity ratio between the resistivity of the wall material 501 at an alternating current of 60 Hz and a temperature of 1600 °C and the molten material 121 being heated by the electrodes at an alternating current of 60 Hz and a temperature of 1600 °C can be greater than or equal to 1.0. Indeed, as shown in the 1600 °C column of Table 3 above, the 1600 °C resistivity ratio between the wall material and the molten material can be within a range of from about 1.0 to about 3.0. For instance, when using XiLEC 5 as the wall material, the 1600 °C resistivity ratio between the XiLEC 5 wall material and the molten material can be within a range of from about 1.0 to about 1.6. Alternatively, performance can be improved when using XiLEC 9 as the wall material. Indeed, the 1600 °C resistivity ratio between the XiLEC 9 wall material and the molten material can be within a range of from about 2.0 to about 3.0. Comparing the 1500 °C resistivity ratio and the 1600 °C resistivity ratio in Table 3 above, the resistivity ratio increases as the temperature increases, thereby suggesting that the resistivity of the samples of glass falls relatively faster than the wall material fabricated from XiLEC 9 and XiLEC 5 material as the temperature increases. As such, the evidence suggests that, under further elevated operating temperatures from 1700 °C to 1750 °C, XiLEC 9 and XiLEC 5 material can provide even larger resistivity ratios between the wall material and the molten material to provide even further resistance to shorting of the electrical current at elevated operating temperatures.

[0065] As shown schematically in FIG. 4, the wall material 501 can define an inner surface of an unbroken path connecting the first through opening 401 with the second through opening 402. As such, the relatively high resistivity of the wall material 501 can further help prevent electrical shorting between the electrodes 301, 302 by providing the wall material 501 with relatively higher resistivity than the molten material along the shortest path between the electrodes.

[0066] Referring to FIG. 4, in some embodiments, the side wall 310 comprises a first side wall portion 403a elevationally defined between an elevation of the base wall 313 and an elevation of a lower periphery of the first through opening 401. As shown in FIG. 5, a height“HI” of the first side wall portion 403a can be defined as a difference between the elevation of the lower periphery of the first through opening 401 and the elevation of the base wall 313. Indeed, as shown in FIG. 5, the height“HI” of the first side wall portion 403a can be the distance between the lowermost portion of the first opening 401 at the inner surface 311 of the side wall 310 and the elevation of the inner surface 312 of the base wall 313 at a location below the first opening 401. Referring to FIG. 4, the side wall 310 can further comprise a second side wall portion 403b elevationally defined between an elevation of the base wall 313 and an elevation of a lower periphery of the second through opening 402. The second side wall portion 403b can also include a corresponding height also defined as the distance between the lowermost portion of the second opening 402 and the inner surface 311 of the side wall 310 and the elevation of the inner surface 312 of the base wall 313 at a location below the second opening 402. In some embodiments, the height“HI” of the first side wall portion 403a and/or the second side wall portion 403b can be greater than 2 inches (about 5 cm) such as greater than 6 inches (about 15 cm) to increase the shortest distance between the electrodes 301, 302, thereby decreasing the likelihood of electrical current shorting of the electrodes 301, 302 through the inner surfaces 311, 312 of the side wall 310 and base wall 313. In some embodiments, increasing the height“HI” of the first side wall portion 403a and/or the second side wall portion 403b can be provided while also providing the wall material 501 defining portions of the inner surfaces 311, 312 (e.g., as discussed above) to further increase the resistivity of the side wall and base wall to still further decrease the likelihood of shorting of the electrodes 301, 302 through the inner surfaces 311, 312 of the side wall 310 and base wall 313 between the electrodes.

[0067] Due to operating conditions of the heating apparatus 300, the side wall portions 403a, 403b of the side wall 310 located beneath a width“W” of the opening

401, 402 can rise to relatively high temperatures compared to other portions of the side wall 310 while heating the material within the containment area 315. In some embodiments where the openings 401, 402 are rectangular, the lower pair of corners 701a, 701b of the opening 401, 402 can rise to particularly relatively high temperatures. For instance, as shown in FIG. 7, the first side wall portion 403a of the side wall 310 located beneath the width“W” of the first opening 401 can experience overheating. Thermal conditions can provide further overheating at the lower corners 701a, 701b of the openings. In some embodiments, overheating can result in undesired wearing of the side wall 310 that can result in failure of the vessel over time and/or other performance inefficiencies of the vessel. Furthermore, overheating can reduce the resistivity of the wall material 501; thereby undesirably increasing the chance of shorting between the electrodes 301, 302.

[0068] Referring to FIG. 4, the first side wall portion 403a of the side wall 310 can be provided with a first cooling device 405a and the second side wall portion 403b of the side wall 310 can be provided with a second cooling device 405b. The cooling devices 405a, 405b can provide targeted enhanced cooling of the side wall 310 and/or base wall 313 to reduce the otherwise relatively high temperatures associated with the side wall portions 403a, 403b of the side wall 310 located beneath the width“W” of the openings and/or lower corners 701a, 701b of the openings 401,

402. Throughout the disclosure, targeted enhanced cooling means that cooling is enhanced at a predetermined target area relative to cooling that may or may not take place at other areas. In some embodiments, a cooling device may physically contact the target area (e.g., the entire target area) to promote targeted enhanced cooling at the target area. Targeted enhanced cooling can be desired to avoid overcooling other areas of the vessel that do not otherwise experience overheating in use. As such, by employing targeted enhanced cooling, energy consumption can be reduced and undesired temperature differentials in the walls of the vessel can be avoided.

[0069] Referring to FIG. 4, in some embodiments, the targeted enhanced cooling can be take place at an elevation of the side wall 310 and/or base wall 313 that is less than or equal to the elevation“E” at 25% of the height“H2” of the electrode 301, 302. In some embodiments, the elevation“E” can correspond to a distance“D” from the lower surface 314 of the base wall 313 equal to the thickness “T” of the base wall 313 added to the height“HI” of the wall portion and 25% of the height“H2” of the electrode. Although the distance“D”, in one embodiment, is illustrated to extend above the lowermost portion of the openings 401, 402, the targeted enhanced cooling can take place on the side wall 310 and/or the base wall 313 surrounding the openings 401, 402. Thus, the area of the targeted enhanced cooling can include an area at or below the lower periphery of the openings 401, 402 and lateral portions extending to the lateral sides of the openings 401, 402 up to the distance “D”. Targeted enhanced cooling above the lowermost portion of the openings 401, 402, such as up to 25% of the height“H2” of the electrode as discussed above can help accommodate overheated portions above the lowermost portions of the openings 401, 402 resulting from the relatively high temperatures associated with the lower comers 701a, 401b of the openings 401, 402 and below the openings 401, 402 discussed above.

[0070] In further embodiments, the targeted enhanced cooling can take place at an elevation of the side wall 310 and/or base wall 313 at or below the lower periphery of the openings 401, 402. For example, targeted enhanced cooling can occur at a distance from the lower surface 314 of the base wall 313 equal to the thickness“T” of the base wall 313 added to the height“HI” of the side wall portion. In still further embodiments, the targeted enhanced cooling can take place at an elevation of the side wall 310 and/or base wall 313 at or below the lower periphery of the openings 401, 402 and within the lateral width“W” of the openings 401, 402. In still further embodiments, as shown in FIG. 6, and in dashed lines 703 in FIG. 7, the targeted enhanced cooling can be limited to the side wall portion 403a, 403b within the height“HI” of the side wall portion and within the lateral width“W” of the opening 401, 402 below the opening 401, 402. In some embodiments, such targeted enhanced cooling locations can accommodate relatively high temperatures associated with the lower corners 701a, 701b and below the openings 401, 402 discussed above.

[0071] Features of the first cooling device 405a will be described with the understanding that such features can also be found in the second cooling device 405b. As shown in FIG. 5, the first cooling device 405a can contact an outer surface 503 of the first side wall portion 403a. In some embodiments, the cooling device can comprise the illustrated plate 505 to provide increased heat transfer from the first side wall portion 403a. In one embodiment, a rod 507 may be positioned to force the plate 505 in a direction 509 towards the outer surface 503 of the first side wall portion 403a to enhance heat transfer from the first side wall portion 403a to the plate 505. As shown in FIG. 6, each side of the plate 505 can optionally include a bracket 601. A thrust plate 603 can be coupled to the end of the rod 507 to help distribute the force over a larger area, thereby reducing the pressure being applied across the surface of the bracket 601. Optionally, a pad 605 positioned between the rod 507 and the plate 505 to increase an electrical resistance between the rod 507 and the plate 505. For instance, the illustrated pad 605 can comprise an electrical insulating material that may be sandwiched between the thrust plate 603 and the bracket 601. As such, shorting of electrical current from the electrodes 301, 302, through the rod to ground can be avoided.

[0072] The plate 505 can comprise a solid plate designed to provide a heat sink for the first side wall portion 403a. Alternatively, as shown, the plate 505 can comprise an internal fluid passage 511 to enhance heat transfer provided by the plate 505. As shown in FIG. 5, the internal fluid passage 511 can optionally define a serpentine path 607 (see FIG. 6). The plate 505 can include a fluid inlet port 609 and a fluid outlet port 611. An inlet conduit 613 can be coupled to the fluid inlet port 609 wherein an inlet cooling fluid stream 615 can be introduced into the internal fluid passage 511 of the plate 505. The fluid stream may then travel along the serpentine path 607 to provide convection heat transfer prior to exiting the fluid outlet port 611 to be carried away by an outlet conduit 617 as an outlet heated fluid stream 619.

[0073] To still further increase heat transfer between the plate 505 and the first side wall portion 403a, a conformable conductive pad 513 may be placed between the plate 505 and the outer surface 503 of the first side wall portion 403a. The conformable pad can enhance thermal communication between the plate 505 and the first side wall portion 403a. The conductive pad 513 can be formed from a wide range of materials such as a metal mesh pad that can be compressed to conform to the engaged surfaces of the plate 505 and the outer surface 503 of the first side wall portion 403a.

[0074] In some embodiments, the plate 505 contacts a portion or the entire area of targeted enhanced cooling discussed above. Thus, with or without the conductive pad 513, the plate 505 can be pressed against the outer surface 503 of the first sidewall portion 403a and may also be pressed against the corresponding outer surface of the base wall 313 at a portion or the entire area of the targeted enhanced cooling discussed above. In some embodiment, the plate 505 does not contact the electrode associated with the opening to help prevent shorting of the electrode.

[0075] Methods of heating molten material will now be discussed with initial reference to heating molten material 121 within the melting vessel 105 with the understanding that similar methods may be conducted to heat molten material 121 in other vessels of the glass manufacturing apparatus 100. Referring to FIG. 1, as indicated by arrow 117, in some embodiments, the batch material 107 can be introduced by the batch delivery device 111 into the containment area 315 of the melting vessel 105. In some embodiments, the melting vessel 105 can heat the batch material 107 to provide molten material 121 within the containment area 315. In further embodiments, the melting vessel 105 may be operable to raise or lower the temperature of a molten material contained within the containment area 315. As shown in FIGS. 3-4, the method of heating the molten material 121 within the containment area 315 can include passing the electric current 325 through the molten material 121 from the first electrode 301 to the second electrode 302.

[0076] In some embodiments, the method can include cooling the side wall portion 403a, 403b with targeted enhanced cooling of the side wall portion 403a, 403b with the cooling device 405a, 405b. In some embodiments, the cooling of the side wall portion 403a, 403b with the cooling device 405a, 405b can be targeted vertically below a lower periphery of the respective through opening 401, 402. Providing targeted enhanced cooling can reduce otherwise excessive temperatures below the electrodes 301, 302 to preserve the integrity of the vessel. In further embodiments provided with the wall material 501, the targeted enhanced cooling can help prevent overheating of the wall material 501 defining the inner surface 311 of the side wall portion 403a, 403b to help prevent shorting of electrical current between the electrodes 301, 302. By preventing shorting of electrical current through the wall material 501, heating efficiency provided by the electric current 325 passing through the molten material 121 between the electrodes 301, 302 can be increased and damage to the wall material 501 can be avoided.

[0077] In some embodiments, the side wall portion 403a, 403b can be cooled by circulating fluid with the cooling device 405a, 405b. The fluid can comprise liquid (e.g., water) or gas (e.g., air) that may be circulated through the internal fluid passage 511 from the fluid inlet port 609 to the fluid outlet port 611. As the fluid circulates along the serpentine path 607 convective heat transfer may help transfer heat from the side wall portion 403a, 403b to the fluid circulating through the internal fluid passage 511. As such, the absorbed heat can be removed from the side wall portion 403a, 403b and carried away with the fluid exiting the fluid outlet port 611. In some embodiments, the fluid may circulate within a closed system where a heat exchanger may remove absorbed heat from the fluid as the fluid travels from the fluid outlet port 611 back to the fluid inlet port 609.

[0078] In still further embodiments, the method can include forcing the cooling device 405a, 405b in the direction 509 toward the side wall portion 403a, 403b. Referring to FIG. 5, in one embodiment, a drive nut 515 may be rotatably mounted to a bracket 517 secured to a base support 519. The rod 507 can include external threads that are threadedly received within a threaded through bore of the drive nut 515. A motor (not shown) can rotate the drive nut 515 to force the rod 507 in the direction 509. In some embodiments, the force applied by the rod 507 can partially collapse the conformable conductive pad 513 to allow the pad to mold to the surface topography of the facing surfaces of the plate 505 and the side wall portion 603a, 603b. Thus, the force applied by the rod 507 can ensure thermal contact between the plate 505 and the side wall portion 603a, 603b while also allowing the conductive pad 513 to conform and further enhance the thermal coupling efficiency of the plate 505 and side wall portion 603a, 603b. [0079] Embodiments and the functional operations described herein can be implemented in digital electronic circuitry, or in computer software, firmware, or hardware, including the structures disclosed in this specification and their structural equivalents, or in combinations of one or more of them. Embodiments described herein can be implemented as one or more computer program products, i.e., one or more modules of computer program instructions encoded on a tangible program carrier for execution by, or to control the operation of, data processing apparatus. The tangible program carrier can be a computer readable medium. The computer readable medium can be a machine-readable storage device, a machine-readable storage substrate, a memory device, or a combination of one or more of them.

[0080] The term“processor” or“controller” can encompass all apparatus, devices, and machines for processing data, including by way of example a programmable processor, a computer, or multiple processors or computers. The processor can include, in addition to hardware, code that creates an execution environment for the computer program in question, e.g., code that constitutes processor firmware, a protocol stack, a database management system, an operating system, or a combination of one or more of them.

[0081] A computer program (also known as a program, software, software application, script, or code) can be written in any form of programming language, including compiled or interpreted languages, or declarative or procedural languages, and it can be deployed in any form, including as a standalone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. A computer program does not necessarily correspond to a file in a file system. A program can be stored in a portion of a file that holds other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files that store one or more modules, sub programs, or portions of code). A computer program can be deployed to be executed on one computer or on multiple computers that are located at one site or distributed across multiple sites and interconnected by a communication network.

[0082] The processes described herein can be performed by one or more programmable processors executing one or more computer programs to perform functions by operating on input data and generating output. The processes and logic flows can also be performed by, and apparatus can also be implemented as, special purpose logic circuitry, e.g., an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit) to name a few.

[0083] Processors suitable for the execution of a computer program include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Generally, a processor will receive instructions and data from a read only memory or a random-access memory or both. The essential elements of a computer are a processor for performing instructions and one or more data memory devices for storing instructions and data. Generally, a computer will also include, or be operatively coupled to receive data from or transfer data to, or both, one or more mass storage devices for storing data, e.g., magnetic, magneto optical disks, or optical disks. However, a computer need not have such devices. Moreover, a computer can be embedded in another device, e.g., a mobile telephone, a personal digital assistant (PDA), to name just a few.

[0084] Computer readable media suitable for storing computer program instructions and data include all forms data memory including nonvolatile memory, media and memory devices, including by way of example semiconductor memory devices, e.g., EPROM, EEPROM, and flash memory devices; magnetic disks, e.g., internal hard disks or removable disks; magneto optical disks; and CD ROM and DVD-ROM disks. The processor and the memory can be supplemented by, or incorporated in, special purpose logic circuitry.

[0085] To provide for interaction with a user, embodiments described herein can be implemented on a computer having a display device, e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor, and the like for displaying information to the user and a keyboard and a pointing device, e.g., a mouse or a trackball, or a touch screen by which the user can provide input to the computer. Other kinds of devices can be used to provide for interaction with a user as well; for example, input from the user can be received in any form, including acoustic, speech, or tactile input.

[0086] Embodiments described herein can be implemented in a computing system that includes a back end component, e.g., as a data server, or that includes a middleware component, e.g., an application server, or that includes a front end component, e.g., a client computer having a graphical user interface or a Web browser through which a user can interact with implementations of the subject matter described herein, or any combination of one or more such back end, middleware, or front end components. The components of the system can be interconnected by any form or medium of digital data communication, e.g., a communication network. Examples of communication networks include a local area network (“LAN”) and a wide area network (“WAN”), e.g., the Internet.

[0087] The computing system can include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.

[0088] It will be appreciated that the various disclosed embodiments may involve particular features, elements or steps that are described in connection with that particular embodiment. It will also be appreciated that a particular feature, element or step, although described in relation to one particular embodiment, may be interchanged or combined with alternate embodiments in various non-illustrated combinations or permutations.

[0089] It is also to be understood that, as used herein the terms“the,”“a,” or “an,” mean“at least one,” and should not be limited to“only one” unless explicitly indicated to the contrary. Likewise, a“plurality” is intended to denote“more than one.”

[0090] Ranges can be expressed herein as from“about” one particular value, and/or to “about” another particular value. When such a range is expressed, embodiments include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent“about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint. [0091] The terms“substantial,”“substantially,” and variations thereof as used herein are intended to note that a described feature is equal or approximately equal to a value or description.

[0092] Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order. Accordingly, where a method claim does not actually recite an order to be followed by its steps or it is not otherwise specifically stated in the claims or descriptions that the steps are to be limited to a specific order, it is no way intended that any particular order be inferred.

[0093] While various features, elements or steps of particular embodiments may be disclosed using the transitional phrase“comprising,” it is to be understood that alternative embodiments, including those that may be described using the transitional phrases“consisting” or“consisting essentially of,” are implied. Thus, for example, implied alternative embodiments to an apparatus that comprises A+B+C include embodiments where an apparatus consists of A+B+C and embodiments where an apparatus consists essentially of A+B+C.

[0094] It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the spirit and scope of the appended claims. Thus, it is intended that the present disclosure cover the modifications and variations of the embodiments herein provided they come within the scope of the appended claims and their equivalents.