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Title:
APPARATUS FOR HOLDING A SUBSTRATE IN A VACUUM DEPOSITION PROCESS, SYSTEM FOR LAYER DEPOSITION ON A SUBSTRATE, AND METHOD FOR HOLDING A SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/108240
Kind Code:
A1
Abstract:
The present disclosure provides an apparatus (100) for holding a substrate (10) in a vacuum deposition process. The apparatus (100) includes a support surface (112), an electrode arrangement (120) having a plurality of electrodes (122) configured to provide an attracting force acting on at least one of the substrate (10) and a mask (20), and a controller (130) configured to apply a first voltage polarity configuration and a second voltage polarity configuration different from the first voltage polarity configuration to the electrode arrangement (120), wherein the controller (130) is configured to switch between the first voltage polarity configuration and the second voltage polarity configuration.

Inventors:
BUSCHBECK WOLFGANG (DE)
LOPP ANDREAS (DE)
HAAS DIETER (US)
GOPARAJU HEMANTH (IN)
Application Number:
PCT/EP2016/080665
Publication Date:
June 21, 2018
Filing Date:
December 12, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
APPLIED MATERIALS INC (US)
BUSCHBECK WOLFGANG (DE)
LOPP ANDREAS (DE)
HAAS DIETER (US)
GOPARAJU HEMANTH (IN)
International Classes:
C23C14/50; C23C14/04; C23C16/04; C23C16/458; H01J37/32; H01L21/683
Domestic Patent References:
WO2015171207A12015-11-12
Foreign References:
US20050213279A12005-09-29
US20020002950A12002-01-10
EP1219141B12010-12-15
US20050095776A12005-05-05
Other References:
None
Attorney, Agent or Firm:
ZIMMERMANN & PARTNER PATENTANWÄLTE MBB (DE)
Download PDF:
Claims:
CLAIMS

1. An apparatus for holding a substrate in a vacuum deposition process, comprising: a support surface; an electrode arrangement having a plurality of electrodes configured to provide an attracting force acting on at least one of the substrate and a mask; and a controller configured to apply a first voltage polarity configuration and a second voltage polarity configuration different from the first voltage polarity configuration to the electrode arrangement, wherein the controller is configured to switch between the first voltage polarity configuration and the second voltage polarity configuration.

2. The apparatus of claim 1, wherein the controller is configured to selectively apply at least one of a first voltage having a first polarity, a second voltage having a second polarity, and ground to the plurality of electrodes.

3. The apparatus of claim 1 or 2, wherein the plurality of electrodes includes one or more first electrodes and one or more second electrodes, wherein the controller is configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and ground to the one or more first electrodes and the one or more second electrodes.

4. The apparatus of claim 3, wherein the plurality of electrodes further includes one or more third electrodes and one or more fourth electrodes, wherein the controller is configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and ground to the one or more third electrodes and the one or more fourth electrodes.

5. The apparatus of claim 3 or 4, wherein the controller is configured to apply the first voltage to the one or more first electrodes and the second voltage or ground to the one or more second electrodes to provide the first voltage polarity configuration.

6. The apparatus of claim 5, wherein the controller is configured to apply the first voltage to at least one of the one or more first electrodes and the one or more second electrodes to provide the second voltage polarity configuration.

7. The apparatus of claim 4, wherein the controller is configured to apply the first voltage to the one or more first electrodes and the one or more third electrodes, and wherein the controller is configured to apply the second voltage to the one or more second electrodes and the one or more fourth electrodes to provide the first voltage polarity configuration.

8. The apparatus of claim 7, wherein the controller is configured to apply the first voltage to the one or more first electrodes and the one or more second electrodes, and wherein the controller is configured to apply the second voltage to the one or more third electrodes and the one or more fourth electrodes to provide the second voltage polarity configuration.

9. The apparatus of claim 7, wherein the controller is configured to apply only the first voltage or the second voltage to the electrode arrangement to provide the second voltage polarity configuration.

10. The apparatus of claim 2 or 3, wherein the one or more first electrodes and the one or more second electrodes are alternately arranged, or wherein the one or more first electrodes the one or more second electrodes, the one or more third electrodes, and the one or more fourth electrodes are alternately arranged.

11. The apparatus of any one of claims 1 to 10, wherein the attracting force includes a first substrate attracting force and a first mask attracting force for the first voltage polarity configuration and a second substrate attracting force and a second mask attracting force for the second voltage polarity configuration, and wherein the second mask attracting force is different from the first mask attracting force.

12. A system for layer deposition on a substrate, including: a vacuum chamber; one or more deposition material sources in the vacuum chamber; and the apparatus of any one of claims 1 to 11 in the vacuum chamber, wherein the apparatus is configured to hold the substrate during the vacuum deposition process.

13. A method for holding a substrate, comprising: applying a first voltage polarity configuration to an electrode arrangement to provide a first attracting force acting on at least one of the substrate and a mask; and applying a second voltage polarity configuration different from the first voltage polarity configuration to the electrode arrangement to provide a second attracting force different from the first attracting force.

14. The method of claim 13, further including at least one of: aligning the mask with respect to the substrate while applying the first voltage polarity configuration; and holding the substrate and the mask while applying the second voltage polarity configuration.

15. The method of claim 13 or 14, further including: holding the substrate in an essentially vertical orientation.

Description:
APPARATUS FOR HOLDING A SUBSTRATE IN A VACUUM DEPOSITION PROCESS, SYSTEM FOR LAYER DEPOSITION ON A SUBSTRATE, AND

METHOD FOR HOLDING A SUBSTRATE

FIELD [0001] Embodiments of the present disclosure relate to an apparatus for holding a substrate in a vacuum deposition process, a system for layer deposition on a substrate, and a method for holding a substrate. Embodiments of the present disclosure particularly relate to an electrostatic chuck (E-chuck) for holding substrates in an essentially vertical orientation.

BACKGROUND

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of microelectronics, such as for organic light emitting diode (OLED) devices, substrates with TFTs, color filters or the like.

[0003] During a vacuum deposition process, the substrate can be supported by a substrate support using, for example, holding devices such as mechanical clamps, to hold the substrate and an optional mask at the substrate support. The substrate and/or the mask should be aligned with respect to each other. In the past, there has been a continuous increase in substrate sizes. The increasing size of substrates makes the handling, supporting and aligning of the substrates and masks, e.g. without sacrificing the throughput by substrate breakage, increasingly challenging.

[0004] Moreover, the space available for holding a substrate inside a vacuum chamber can be limited. Accordingly, there is also a need to reduce the space used by supporting systems for holding a substrate inside a vacuum chamber. [0005] In view of the above, new apparatuses for holding a substrate in a vacuum deposition process, systems for layer deposition on a substrate, and methods for holding a substrate, that overcome at least some of the problems in the art are beneficial. The present disclosure particularly aims at providing an apparatus, system and method for reliably holding a substrate and an optional mask in a precisely aligned orientation e.g. during a vacuum deposition process.

SUMMARY

[0006] In light of the above, an apparatus for holding a substrate in a vacuum deposition process, a system for layer deposition on a substrate, and a method for holding a substrate are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0007] According to an aspect of the present disclosure, an apparatus for holding a substrate in a vacuum deposition process is provided. The apparatus includes a support surface, an electrode arrangement having a plurality of electrodes configured to provide a attracting force acting on at least one of the substrate and a mask, and a controller configured to apply a first voltage polarity configuration and a second voltage polarity configuration different from the first voltage polarity configuration to the electrode arrangement, wherein the controller is configured to switch between the first voltage polarity configuration and the second voltage polarity configuration.

[0008] According to another aspect of the present disclosure, a system for layer deposition on a substrate is provided. The system includes a vacuum chamber, one or more deposition material sources in the vacuum chamber, and the apparatus for holding the substrate in a vacuum deposition process according to the embodiments described herein. The apparatus is configured to hold the substrate during the vacuum deposition process.

[0009] According to a further aspect of the present disclosure, a method for holding a substrate is provided. The method includes applying a first voltage polarity configuration to an electrode arrangement to provide a first attracting force acting on at least one of the substrate and a mask, and applying a second voltage polarity configuration different from the first voltage polarity configuration to the electrode arrangement to provide a second attracting force different from the first attracting force.

[0010] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1A shows a schematic view of an apparatus for holding a substrate in a vacuum deposition process with a first voltage polarity configuration according to embodiments described herein; FIG. IB shows a schematic view of the apparatus of FIG. 1A with a second voltage polarity configuration according to embodiments described herein;

FIG. 2 shows a schematic view of an electrode arrangement according to embodiments described herein; FIG. 3 shows a schematic view of an electrode arrangement according to further embodiments described herein;

FIG. 4 shows a schematic view of an electrode arrangement according to yet further embodiments described herein; FIGs. 5A to C illustrate voltage polarity configurations according to embodiments described herein;

FIG. 6 shows a schematic view of a system for layer deposition on a substrate according to embodiments described herein; and

FIG. 7 shows a flow chart of a method for holding a substrate according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS [0012] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0013] In OLED coating systems, the substrate can be held during transport and deposition by a bipolar E-chuck. During coating a metal mask can be provided. The mask can be aligned with respect to the substrate before the coating. As an example, the mask can be provided at a distance of about 0.2 mm or less from the substrate during the alignment process. At such a distance, the attracting force between the metal mask and the E-chuck is not negligible and the mask can come into unwanted contact with the substrate 10. In conventional systems, a magnet plate can be provided to attract the mask and ensure a full face contact between the mask and the substrate during coating.

[0014] The present disclosure uses an electrode arrangement, such as a grid, switchable between at least two different voltage polarity configurations providing different attracting forces acting on the substrate and/or the mask. As an example, the first voltage polarity configuration can provide a strong force on the substrate to hold the substrate and a small (or even no) force on the mask such that the mask can be aligned with respect to the substrate. In particular, an unwanted attraction of the mask e.g. during an alignment process of the mask can be avoided. Switching from the first voltage polarity configuration to the second voltage polarity configuration can provide an increased force on the mask such that both the substrate and the mask can be fixedly held at the substrate support. Accordingly, the substrate and the optional mask can be reliably held in a precisely aligned orientation e.g. during a vacuum deposition process. [0015] Further, during a deposition process, e.g. after the aligning, a full face contact between mask and substrate is beneficial. This contact can be achieved using a magnet plate behind the carrier/chuck. The present disclosure can dispense with the magnet plate. In particular, no magnet plate has to be provided, because the E-chuck will adopt the function of the magnet plate. [0016] FIG. 1A shows a schematic view of an apparatus 100 for holding a substrate 10 in a vacuum deposition process with a first voltage polarity configuration according to embodiments described herein. FIG. IB shows a schematic view of the apparatus 100 of FIG. 1A with a second voltage polarity configuration. The voltage polarity configurations illustrated in FIGs. 1A and B can be provided by, for example, the electrode arrangement illustrated in FIGs. 2 and 4. The apparatus 100 can be a substrate support, such as a carrier. In particular, the apparatus 100 according to the present disclosure can be an electrostatic chuck (E-chuck) providing an electrostatic force.

[0017] The apparatus 100 includes a support surface 112, an electrode arrangement 120 having a plurality of electrodes 122 configured to provide an attracting force for holding at least one of the substrate 10 and a mask 20 at the support surface 112, and a controller 130. The controller 130 is configured to apply a first voltage polarity configuration (e.g., FIG. 1A) and a second voltage polarity configuration (e.g. FIG. IB) different from the first voltage polarity configuration to the electrode arrangement 120. The controller 130 is configured to switch at least between the first voltage polarity configuration and the second voltage polarity configuration. Although the switching between two different voltage polarity configurations is exemplarily illustrated, is to be understood that the present disclosure is not limited thereto and that the apparatus 100 can be configured for switching between more than two voltage polarity configurations, such as three, four or even five different voltage polarity configurations.

[0018] According to the present disclosure, the apparatus 100 can switch between at least two different modes, which can be different wiring modes of the electrodes. In the first mode, a strong attraction force on the substrate and a very low force on the mask e.g. during alignment is provided. As an example, the electrodes can have a fine alternating structure, as it is for instance illustrated on the left side of FIG. 5A. In the second mode, a strong attraction force on the substrate and a strong force on the mask is provided. As an example, the electrodes can have a wide alternating structure, as it is for instance illustrated on the right side of FIG. 5 A, or can be wired in a unipolar manner. No magnet plate has to be provided because the apparatus 100 can provide the function of the magnet plate.

[0019] The apparatus 100 can include a body 110 providing the support surface 112, which can be an essentially flat surface configured for contacting e.g. a back surface of the substrate 10. In particular, the substrate 10 can have a front surface (also referred to as "processing surface") opposite the back surface and on which a layer is deposited during the vacuum deposition process.

[0020] The plurality of electrodes 122 of the electrode arrangement 120 can be embedded in the body, or can be provided, e.g., placed, on the body 110. According to some embodiments, which can be combined with other embodiments described herein, the body 110 is a dielectric body, such as a dielectric plate. The dielectric body can be fabricated from a dielectric material, preferably a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or an equivalent material, but may be made from such materials as polyimide. In some embodiments, the plurality of electrodes 122, such as a grid of fine metal strips, can be placed on the dielectric plate and covered with a thin dielectric layer.

[0021] According to some embodiments, which can be combined with other embodiments described herein, the apparatus 100 includes one or more voltage sources configured to apply one or more voltages to the plurality of electrodes 122. In some implementations, the one or more voltage sources are configured to ground at least some electrodes of the plurality of electrodes 122. As an example, the one or more voltage sources can be configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and/or ground to the plurality of electrodes 122. According to some embodiments, each electrode, every second electrode, every third electrode or every fourth electrode of the plurality of electrodes can be connected to a separate voltage source.

[0022] The controller 130 can be configured to control the one or more voltage sources for applying the one or more voltages and/or ground to the electrode arrangement 120. In some implementations, the controller 130 can be integrated into the one or more voltage sources, or vice versa. In further implementations, the controller 130 can be provided as a separate entity connected to the one or more voltage sources, for example, via a cable connection and/or a wireless connection.

[0023] The term "polarity" refers to an electric polarity, i.e., negative (-) and positive (+). As an example, the first polarity can be the negative polarity and the second polarity can be the positive polarity, or the first polarity can be the positive polarity and the second polarity can be the negative polarity. As used throughout the present disclosure, the term "voltage polarity configuration" refers to polarities of voltages applied to the electrode arrangement 120, and particularly to the plurality of electrodes 122. In other words, the voltage polarity configuration means that a positive and/or a negative polarity is applied to at least one electrode of the plurality of electrodes 122. Yet, one or more electrodes of the plurality of electrodes 122 can be grounded. As long as at least one electrode of the plurality of electrodes 122 is provided with a positive or negative polarity to provide the attracting force, the electrode arrangement 120 has a defined voltage polarity configuration, such as the first voltage polarity configuration and the second voltage polarity configuration. If all electrodes of the plurality of electrodes are grounded, no voltage polarity configuration exists because there is no positive and/or negative polarity and thus no attracting force is exerted on the substrate 10 and/or the mask 20.

[0024] Further, the plurality of electrodes 122 have a spatial arrangement in the apparatus 100, for example, the body 110. Accordingly, a spatial arrangement of the polarities may correspond to the spatial arrangement of the electrodes to which a voltage is applied. In other words, the term "voltage polarity configuration" may also be understood in the sense that polarities are spatially distributed, for example, across the support surface 112.

[0025] The electrode arrangement 120, and particularly the plurality of electrodes 122, are configured to provide the attracting force, such as a chucking force. The attracting force can be a force acting on the substrate 10 and/or the mask 20 at a certain relative distance between the plurality of electrodes 122 (or the support surface 112) and the substrate 10 and/or the mask 20. The attracting force can be an electrostatic force provided by the voltages applied to the plurality of electrodes 122, and particularly by the first voltage polarity configuration and the second voltage polarity configuration. A magnitude of the attracting force may be determined by the respective voltage polarity configuration and a voltage level. The attracting force can be changed by altering the voltage polarity configuration and optionally by altering the voltage level. In particular, the attracting force acting on the substrate 10 and/or the mask 20 can be changed by switching between the first voltage polarity configuration and the second polarity configuration and optionally by adjusting the voltage level(s).

[0026] In some implementations, the switching between the first voltage polarity configuration and the second voltage polarity configuration includes keeping the voltage levels of the voltages applied to the electrode arrangement 120 essentially constant. In other implementations, the switching between the first voltage polarity configuration and the second voltage polarity configuration includes e.g. simultaneously increasing and/or decreasing the voltage level(s) of the voltage(s) applied to the electrode arrangement 120. As an example, the voltage levels applied to one or more of the electrodes of the plurality of electrodes 122 can be increased or decreased such that the attracting force acting on the substrate 10 remains essentially constant while the attracting force acting on the mask 20 is increased or decreased. The substrate 10 can be fixedly held at the support surface 112 while the mask can first be aligned and then be attracted and fixed.

[0027] According to some embodiments, which can be combined with other embodiments described herein, the first voltage polarity configuration and the second voltage polarity configuration can be selected from the group consisting of unipolar and bipolar. In particular, the unipolar configuration includes polarities of only one kind, i.e., either the first polarity or the second polarity, and optionally includes one or more grounded electrodes. The bipolar configuration includes both kinds of polarities, i.e., the first polarity and the second polarity, and optionally includes one or more grounded electrodes. In some implementations, the apparatus 100 can be a unipolar E-chuck, a bipolar E-chuck, or a combined E-chuck switchable between the unipolar configuration and the bipolar configuration.

[0028] Referring to FIG. 1A, the electrode arrangement 120 is shown with the first voltage polarity configuration. FIG. IB illustrates the electrode arrangement 120 with the second voltage polarity configuration. Dashed squares indicate electrodes having e.g. the first polarity and open squares indicate electrodes having e.g. the second polarity. Although not illustrated in the examples of FIG. 1A and B, it is to be understood that at least one electrode of the plurality of electrodes 122 can be grounded.

[0029] The voltage polarity configurations provide respective attracting forces for the substrate 10 and the mask 20. It is noted that the attracting force for the substrate 10 and the mask 20 provided by a respective voltage polarity configuration can be different. In particular, the attracting force can be defined with respect to the entity on which the attracting force acts. As an example, the attracting force acting on the substrate 10 can be referred to as "substrate attracting force". Likewise, the attracting force acting on the mask 20 can be referred to as "mask attracting force". Yet, the term "attracting force" shall embrace both the substrate attracting force and the mask attracting force. [0030] The attracting force can be a first attracting force for the first voltage polarity configuration and a second attracting force for the second voltage polarity configuration, wherein the second attracting force is different from the first attracting force. As an example, the first attracting force can include a first substrate attracting force 140 and a first mask attracting force 142. The second attracting force can include a second substrate attracting force 140' and a second mask attracting force 142'. The second substrate attracting force 140' can be different from the first substrate attracting force 140. Likewise, the second mask attracting force 142' can be different from the first mask attracting force 142. In other examples, the first substrate attracting force 140 and the second substrate attracting force 140' can be essentially the same and the second mask attracting force 142' can be different from the first mask attracting force 142. [0031] The substrate 10 is attracted by the attracting force provided by the apparatus 100, which can be an E-chuck, towards the support surface 112 (e.g., in a direction 2, which can be a horizontal direction perpendicular to a vertical direction 1). The attracting force can be strong enough to hold the substrate 10 e.g. in a vertical position by frictional forces. In particular, the attracting force, such as the first substrate attracting force 140 and/or the second substrate attracting force 140', can be configured to fix the substrate 10 on the support surface 112 essentially immoveably. For example, to hold a 0.5 mm glass substrate in a vertical position using friction forces, an attracting pressure of about 50 to 100 N/m 2 (Pa) can be used, depending on the friction coefficient. [0032] Referring to FIG. 1A, the plurality of electrodes 122 has alternating polarities in the first voltage polarity configuration. In other words, adjacent electrodes have opposite polarities (e.g., + - + - + -). As shown in FIG. IB, the plurality of electrodes are provided as pairs in the second voltage polarity configuration. The electrodes of each pair have the same polarity, wherein adjacent pairs have different (alternating) polarities. In other words, adjacent pairs have opposite polarities (e.g., + + - - + +).

[0033] The first voltage polarity configuration as exemplarily illustrated in FIG. 1A can be referred to as "fine grid structure". Such a first voltage polarity configuration can provide a strong force acting on a substrate 10 (the first substrate attracting force 140) and a small force acting on the mask 20 (the first mask attracting force 142). The second voltage polarity configuration as exemplarily illustrated in FIG. IB can be referred to as "wide grid structure". In the present example, the wide grid can behave like the fine grid with double width or spacing. The second voltage polarity configuration can provide essentially the same or a reduced force acting on the substrate 10 (the second substrate attracting force 140') and an increased force acting on the mask 20 (the second mask attracting force 142'; e.g., ¼ of the attracting force at the mask 20).

[0034] As an example, a reduction of a line width (a width of the individual electrodes) and a gap width (a spacing between adjacent electrodes) from (1mm / 1mm) to (0.5mm / 0.5 mm) can increase the attracting force on the substrate 10 by a factor of about 3 and can reduce the attracting force on the mask by about 3.5. An operating voltage can be reduced by about 42% for the same attracting force on the substrate 10. The attracting force on the mask 20, which can be a metal mask, can be reduced by a factor of more than 10. [0035] According to some embodiments, which can be combined with other embodiments described herein, the one or more voltages applied to the plurality of electrodes can be selected such that an attracting force on the substrate 10 provided by the first voltage polarity configuration (e.g., the first substrate attracting force 140) and an attracting force on the substrate 10 provided by the second voltage polarity configuration (the second substrate attracting force 140') are essentially the same, e.g., within a tolerance range. In other words, the attracting force acting on a substrate 10 can be essentially constant while the attracting force acting on the mask 20 is changed when switching from the first voltage polarity configuration to the second voltage polarity configurations, or vice versa. The attracting force can be adjusted by adjusting the voltage levels of at least some of the voltages applied to the electrode arrangement 120 when switching between the voltage polarity configurations.

[0036] In some implementations, the mask 20 can be aligned with respect to the substrate 10 and/or the apparatus 100 while applying the first voltage polarity configuration. As an example, the mask 20 can be positioned at a distance of less than 1 mm, such as between 100 nm and 1000 nm, and specifically at a distance of between 200 nm and 500 nm in front of the substrate 10 during the alignment process. The substrate 10 can be fixed to the support surface 112 by the first substrate attracting force 140 during the alignment process.

[0037] As illustrated in FIG. IB, after the alignment of the mask 20, the controller 130 can switch to the second voltage polarity configuration such that the second mask attracting force 142' acting on the mask 20 pulls the mask 20 towards the support surface 112 and the substrate 10. The second voltage polarity configuration can be adapted such that the mask 20 is fixedly held at the apparatus 100.

[0038] Although not illustrated, it is to be understood that the mask 20 can be omitted. As an example, the attracting force in the first voltage polarity configuration can be selected such that substrate 10 contacts the support surface 112 but is still movable. The substrate 10 can be aligned with respect to the support surface 112. After the alignment, the first voltage polarity configuration can be changed into the second voltage polarity configuration to increase the attracting force acting on the substrate 10 to fix the substrate 10 on the support surface 112 essentially immovably. [0039] According to some embodiments, which can be combined with other embodiments described herein, the apparatus 100 is configured for supporting the substrate 10 in a substantially vertical orientation (with respect to the vertical direction 1), and in particular during the vacuum deposition process. As used throughout the present disclosure, "substantially vertical" is understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction or orientation of ±20° or below, e.g. of ±10° or below. This deviation can be provided for example because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position. Further, fewer particles reach the substrate surface when the substrate is tilted forward. Yet, the substrate orientation, e.g., during the vacuum deposition process, is considered substantially vertical, which is considered different from the horizontal substrate orientation, which may be considered as horizontal ±20° or below.

[0040] The term "vertical direction" or "vertical orientation" is understood to distinguish over "horizontal direction" or "horizontal orientation". That is, the "vertical direction" or "vertical orientation" relates to a substantially vertical orientation e.g. of the carrier and the substrate, wherein a deviation of a few degrees, e.g. up to 10° or even up to 15°, from an exact vertical direction or vertical orientation is still considered as a " substantially vertical direction" or a "substantially vertical orientation". The vertical direction can be substantially parallel to the force of gravity. [0041] The embodiments described herein can be utilized for evaporation on large area substrates, e.g., for display manufacturing. Specifically, the substrates for which the structures and methods according to embodiments described herein are provided, are large area substrates. For instance, a large area substrate or carrier can be GEN 4.5, which corresponds to a surface area of about 0.67 m 2 (0.73 x 0.92m), GEN 5, which corresponds to a surface area of about 1.4 m 2 (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m 2 (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m 2 (2.2 m x 2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m 2 (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of the Gen generations may also be provided in OLED display manufacturing. [0042] According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1 to 1.8 mm. The substrate thickness can be about 0.9 mm or below, such as 0.5 mm. The term "substrate" as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto and the term "substrate" may also embrace flexible substrates such as a web or a foil. The term "substantially inflexible" is understood to distinguish over "flexible". Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0043] According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass, and the like), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[0044] The term "masking" may include reducing and/or hindering a deposition of material on one or more regions of the substrate 10. The masking may be useful, for instance, in order to define the area to be coated. In some applications, only parts of the substrate 10 are coated and the parts not to be coated are covered by the mask 20.

[0045] FIG. 2 shows a schematic view of an electrode arrangement 220 according to embodiments described herein.

[0046] According to some embodiments, which can be combined with other embodiments described herein, the plurality of electrodes 222 are arranged as a grid. As an example, the plurality of electrodes 222 can be wires, lines or strips of a conductive material. The conductive material can be selected from the group consisting of a metal, copper, aluminum, and any combination thereof. The plurality of electrodes 222 can extend essentially parallel to each other in a first direction. The first direction can correspond to a length extension of the wires, lines or strips. The plurality of electrodes 222 can be spaced apart from each other in a second direction perpendicular to the first direction. The distance between adjacent electrodes of the plurality of electrodes 222 in the second direction can be between 0.1 mm and 5 mm, specifically between 0.1 and 2 mm, and more specifically between 0.5 and 1 mm. [0047] According to some embodiments, which can be combined with other embodiments described herein, the controller is configured to selectively and/or individually apply at least one of the first voltage having the first polarity, the second voltage having the second polarity, and ground to the plurality of electrodes 222. As an example, the apparatus can include a voltage source assembly 224 including one or more voltage sources configured to selectively and/or individually apply at least one of the first voltage having the first polarity, the second voltage having the second polarity, and ground to the plurality of electrodes 222. In some embodiments, each electrode of the plurality of electrodes 222 can be connected to a respective voltage source. In further embodiments, two or more electrodes of the plurality of electrodes 222 can be connected to the same voltage source. As an example, every fourth electrode of the plurality of electrodes 222 can be connected to the same voltage source. The voltage source assembly 224 can be configured to provide e.g. the first voltage polarity configuration and the second voltage polarity configuration as illustrated in FIGs. 1 A and B.

[0048] According to some embodiments, which can be combined with other embodiments described herein, the plurality of electrodes has a width in the second direction. As an example, the width can be between 0.1 mm and 5 mm, specifically between 0.1 and 2 mm, and more specifically between 0.5 and 1 mm.

[0049] FIG. 3 shows a schematic view of an electrode arrangement 320 according to further embodiments described herein. The electrode arrangement 320 can be referred to as "single grid".

[0050] According to some embodiments, which can be combined with other embodiments described herein, the plurality of electrodes includes one or more first electrodes 322 and one or more second electrodes 324. The one or more first electrodes 322 can form a first grid and/or a first electrode pattern. Likewise, the one or more second electrodes 324 can form a second grid and/or a second electrode pattern. [0051] The plurality of electrodes, such as the one or more first electrodes 322 and/or the one or more second electrodes 324, can extend essentially parallel to each other in a first direction. The first direction can correspond to a length extension of the electrodes, such as wires, lines or strips. The one or more first electrodes 322 can be spaced apart from each 5 other by a first distance in a second direction perpendicular to the first direction. Likewise, the one or more second electrodes 324 can be spaced apart from each other by a second distance in the second direction. The first distance and the second distance can be essentially identical. As an example, the first distance and/or the second distance can be between 0.1 mm and 5 mm, specifically between 0.1 and 2 mm, and more specifically 10 between 0.5 and 1 mm.

[0052] According to some embodiments, which can be combined with other embodiments described herein, the one or more first electrodes 322 and the one or more second electrodes 324 are alternately arranged. As an example, the one or more first electrodes 322 and the one or more second electrodes 324 can be provided in an

15 interleaved arrangement, as it is illustrated in FIG. 3. In particular, an electrode of the one or more first electrodes 322 can be provided between two adjacent electrodes of the one or more second electrodes 324. Likewise, an electrode of the one or more second electrodes 324 can be provided between two adjacent electrodes of the one or more first electrodes 322. A distance between an electrode of the one or more first electrodes 322 and an

20 adjacent electrode of the one or more second electrodes 324 can be half the first distance and/or the second distance. In other words, an electrode of the one or more first electrodes 322 can be provided at a center between two adjacent electrodes of the one or more second electrodes 324. Likewise, an electrode of the one or more second electrodes 324 can be provided at a center between two adjacent electrodes of the one or more first electrodes

25 322. Accordingly, an electrode spacing (also referred to as "line spacing") of the electrode arrangement 320 can be half the electrode spacing of the one or more first electrodes 322 and/or the one or more second electrodes 324.

[0053] The controller can be configured to apply the first voltage having the first polarity, the second voltage having the second polarity, and ground to the one or more first 30 electrodes 322 and the one or more second electrodes 324. In some implementations, the one or more first electrodes 322 can be connected to a first voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more first electrodes 322. The one or more second electrodes 324 can be connected to a second voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more second electrodes 324. The one or more first electrodes 322 and the one or more second electrodes 324 can be electrically insulated from each other,

[0054] FIG. 4 shows a schematic view of an electrode arrangement 420 according to yet further embodiments described herein. The electrode arrangement 320 can be referred to as "double grid". [0055] According to some embodiments, which can be combined with other embodiments described herein, the plurality of electrodes includes one or more first electrodes 422, one or more second electrodes 424, one or more third electrodes 426, and one or more fourth electrodes 428. The one or more first electrodes 422 can form a first grid and/or a first electrode pattern. The one or more second electrodes 424 can form a second grid and/or a second electrode pattern. The one or more third electrodes 426 can form a third grid and/or a third electrode pattern. And, the one or more fourth electrodes 428 can form a fourth grid and/or a fourth electrode pattern. The one or more first electrodes 422, the one or more second electrodes 424, the one or more third electrodes 426, and the one or more fourth electrodes 428 can be electrically insulated from each other.

[0056] The one or more first electrodes 422, the one or more second electrodes 424, the one or more third electrodes 426, and the one or more fourth electrodes 428 can extend essentially parallel to each other in a first direction. The first direction can correspond to a length extension of the electrodes, such as wires, lines or strips. The one or more first electrodes 422 can be spaced apart from each other by a first distance in a second direction perpendicular to the first direction. The one or more second electrodes 424 can be spaced apart from each other by a second distance in the second direction. The one or more third electrodes 426 can be spaced apart from each other by a third distance in the second direction. And, the one or more fourth electrodes 428 can be spaced apart from each other by a fourth distance in the second direction. The first distance, the second distance, the third distance and the fourth distance can be essentially identical. As an example, each of the first distance, the second distance, the third distance and the fourth distance can be between 0.1 mm and 5 mm, specifically between 0.1 and 2 mm, and more specifically between 0.5 and 1 mm.

[0057] According to some embodiments, which can be combined with other embodiments described herein, the one or more first electrodes 422, the one or more second electrodes 424, the one or more third electrodes 426, and the one or more fourth electrodes 428 are alternately arranged. As an example, the electrodes can be provided in an interleaved arrangement, as it is illustrated in FIG. 4. In particular, the electrode arrangement can be configured such that, between adjacent electrodes of one grid, one electrode of each of the other grids is arranged. As an example, between adjacent electrodes of the first grid provided by the one or more first electrodes 422, one electrode of the second grid, one electrode of the third grid, and one electrode of the fourth grid is arranged.

[0058] A distance between adjacent electrodes of the interleaved arrangement can be a quarter of the spacing between the electrodes of the individual grid, such as a quarter of the first distance, the second distance, the third distance and/or the fourth distance. The distance between the adjacent electrodes of the interleaved arrangement can be essentially constant for the electrode arrangement 420.

[0059] The controller can be configured to apply the first voltage having the first polarity, the second voltage having the second polarity, and ground to the one or more first electrodes 422, the one or more second electrodes 424, the one or more third electrodes 426, and the one or more fourth electrodes 428. In some implementations, the one or more first electrodes 422 can be connected to a first voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more first electrodes 422. The one or more second electrodes 424 can be connected to a second voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more second electrodes 424. The one or more third electrodes 426 can be connected to a third voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more third electrodes 426. The one or more fourth electrodes 428 can be connected to a fourth voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more fourth electrodes 428. In the interleaved arrangement, every fourth electrode is connected to the same voltage supply.

[0060] The double grid illustrated in FIG. 4 can provide multiple voltage polarity configurations, such as a number of bipolar and unipolar configurations. An attracting force for the substrate and/or the mask can be adjusted with a high degree of flexibility.

[0061] FIGs. 5 A to C illustrate voltage polarity configurations according embodiments described herein. The voltage polarity configurations can be implemented using, for example, the electrode arrangements illustrated in FIGs. 1 to 4. [0062] FIG. 5 A illustrates a switch between two bipolar voltage polarity configurations. In particular, a switching between the fine grid 501 (left side of FIG. 5 A) and a wide grid 502 (right side of FIG. 5 A) is shown. The illustrated switching can be accomplished using, for example, the electrode arrangements of FIGs. 1A, IB, 2 and 4.

[0063] As an example, the electrode arrangement can include one or more first electrodes, the one or more second electrodes, the one or more third electrodes, and the one or more fourth electrodes. The electrodes can be alternately arranged. As shown on the left side of FIG. 5A, the controller can be configured to apply the first voltage (e.g. with a positive polarity) to the one or more first electrodes and the one or more third electrodes.

The controller can further be configured to apply the second voltage (e.g. with a negative polarity) to the one or more second electrodes and the one or more fourth electrodes to provide the first voltage polarity configuration. Accordingly, the fine grid 501 with alternating polarities is provided.

[0064] As illustrated on the right side of FIG. 5A, the controller can be configured to apply the first voltage (e.g. with the positive polarity) to the one or more first electrodes and the one or more second electrodes. The controller can be configured to apply the second voltage (e.g. with the negative polarity) to the one or more third electrodes and the one or more fourth electrodes to provide the second voltage polarity configuration. Accordingly, the wide grid 502 is provided, wherein pairs of adjacent electrodes have alternating polarities. [0065] The fine grid provides a reduced force on the mask. The mask can be aligned using the first voltage polarity configuration while an unwanted contact with the substrate due to the attracting force acting on the mask can be avoided. Switching to the second voltage polarity configurations provides an increased force on the mask such that mask can be fixed at the substrate 10 in an aligned and stable manner. Further, the attracting force to the substrate increases with the fineness of the grid. This allows to operate the finer structure with a lower voltage.

[0066] Although not illustrated, the bipolar voltage polarity configuration shown on the left side of FIG. 5A can be switched into a unipolar voltage polarity configuration. As an example, the controller can be configured to apply only the first voltage or the second voltage to the electrode arrangement to provide the second voltage polarity configuration (e.g., the left side of FIG. 5B).

[0067] According to some embodiments, which can be combined with other embodiments described herein, the voltage levels of at least some of the voltages applied to the electrode arrangement can be, e.g. simultaneously, adjusted when switching between the voltage polarity configurations. The attracting force acting on the substrate and/or the mask can be tuned, for example, to keep the attracting force on the substrate essentially the same for both voltage polarity configurations while changing the attracting force on the mask. [0068] FIG. 5B illustrates a switching between two unipolar voltage polarity configurations. In particular, a switching between the fine grid 501 ' (left side of FIG. 5B) and a wide grid 502' (right side of FIG. 5B) is shown. The illustrated switching can be accomplished using, for example, the electrode arrangements of FIGs. 2 and 3.

[0069] As an example, the electrode arrangement can include the one or more first electrodes and the one or more second electrodes. The electrodes can be alternately arranged. As shown on the left side of FIG. 5B, the controller can be configured to apply the first voltage (e.g. with the positive polarity or the negative polarity) to the one or more first electrodes and the one or more second electrodes to provide one of the one polarity configurations. Accordingly, a unipolar fine grid is provided. [0070] As illustrated on the right side of FIG. 5B, for the other voltage polarity configuration, the controller can be configured to apply the first voltage to the one or more first electrodes (or the one or more second electrodes) and ground to the one or more second electrodes (or the one or more first electrodes). Accordingly, a unipolar wide grid is provided.

[0071] FIG. 5C illustrates a switching between a bipolar voltage polarity configuration 501 " (left side of FIG. 5C) and a unipolar voltage polarity configuration 502" (right side of FIG. 5C). The illustrated switching can be accomplished using, for example, the electrode arrangements of FIGs. 1 to 4. [0072] As an example, the electrode arrangement can include the one or more first electrodes and the one or more second electrodes. The electrodes can be alternately arranged. As shown on the left side of FIG. 5C, the controller is configured to apply the first voltage (e.g., with a positive polarity) to the one or more first electrodes and the second voltage (e.g., with a negative polarity) to the one or more second electrodes to provide the first voltage polarity configuration. Accordingly, a bipolar grid with alternating polarities is provided.

[0073] As illustrated on the right side of FIG. 5C, the controller can be configured to apply the first voltage (or the second voltage) to the one or more first electrodes or the one or more second electrodes to provide the second voltage polarity configuration. The other electrodes of the one or more first electrodes and the one or more second electrodes can be grounded. Accordingly, a unipolar wide grid is provided.

[0074] FIG. 6 shows a schematic view of a system 600 for layer deposition on a substrate 10 according to embodiments described herein.

[0075] The system 600 includes a vacuum chamber 602, one or more deposition material sources in the vacuum chamber 602, and the apparatus 100 for holding the substrate 10 in a vacuum deposition process according to the embodiments described herein. The apparatus 100 is configured to hold the substrate 10 during the vacuum deposition process. The system 600 can be configured for evaporation of e.g. an organic material for the manufacture of OLED devices. In another example, the system can be configured for CVD or PVD, such as sputter deposition.

[0076] In some implementations, the one or more material deposition sources 680 can be evaporation sources, particularly evaporation sources for depositing one or more organic materials on a substrate to form a layer of an OLED device. The apparatus 100, which can be a substrate support or carrier, for supporting the substrate 10 e.g. during a layer deposition process can be transported into and through the vacuum chamber 602, and in particular through a deposition area, along a transportation path, such as a linear transportation path. [0077] As indicated in FIG. 6, further chambers can be provided adjacent to the vacuum chamber 602. The vacuum chamber 602 can be separated from adjacent chambers by a valve having a valve housing 604 and a valve unit 606. After the apparatus 100 with the substrate 10 thereon is inserted into the vacuum chamber 602 as indicated by the arrow, the valve unit 606 can be closed. The atmosphere in the vacuum chamber 602 can be individually controlled by generating a technical vacuum, for example with vacuum pumps connected to the vacuum chamber 602.

[0078] According to some embodiments, the apparatus 100 and the substrate 10 are static or dynamic during deposition of the deposition material. According to some embodiments described herein, a dynamic deposition process can be provided, e.g., for the manufacture of OLED devices.

[0079] In some implementations, the system 600 can include one or more transportation paths extending through the vacuum chamber 602. The apparatus 100 can be configured for transportation along the one or more transportation paths, for example, past the one or more material deposition sources 680. Although in FIG. 6 one transportation path is exemplarily indicated by the arrow, it is to be understood that the present disclosure is not limited thereto and that two or more transportation paths can be provided. As an example, at least two transportation paths can be arranged substantially parallel to each other for transportation of respective carriers. The one or more material deposition sources 680 can be arranged between the two transportation paths. [0080] FIG. 7 shows a flow chart of a method 700 for holding a substrate according to embodiments described herein. The method can utilize the apparatuses and systems according to the present disclosure.

[0081] The method includes in block 710 applying a first voltage polarity configuration to an electrode arrangement to provide a first attracting force acting on at least one of the substrate and a mask, and in block 720 applying a second voltage polarity configuration different from the first voltage polarity configuration to the electrode arrangement to provide a second attracting force different from the first attracting force.

[0082] According to some embodiments, the method 700 further includes aligning the mask with respect to the substrate while applying the first voltage polarity configuration and/or holding the substrate and the mask while applying the second voltage polarity configuration. In some implementations, the method 700 includes holding the substrate in an essentially vertical orientation.

[0083] According to embodiments described herein, the method for holding a substrate can be conducted using computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, and input and output devices being in communication with the corresponding components of the apparatus for processing a large area substrate.

[0084] The present disclosure uses an electrode arrangement, such as a grid, switchable between at least two different voltage polarity configurations providing different attracting forces acting on the substrate and/or the mask. As an example, the first voltage polarity configuration can provide a strong force on the substrate and a small (or even no) force on the mask such that the mask can be aligned with respect to the substrate. Switching from the first voltage polarity configuration to the second voltage polarity configuration can provide an increased force on the mask such that both the substrate and the mask can be fixedly held at the substrate support. Accordingly, the substrate and the optional mask can be reliably held in a precisely aligned orientation e.g. during a vacuum deposition process. Further, no magnet plate has to be provided, because the E-chuck will adopt the function of the magnet plate. [0085] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.