APPARATUS AND METHOD FOR ABRADING SEMICONDUCTOR WAFER

WIPO Patent Application WO/2002/054471

A1

An apparatus and a method for abrading the outer circumferential part or the notched part of a semiconductor wafer with high accuracy. The apparatus A for abrading a semiconductor wafer comprises a mechanism for mounting a stack of semiconductor wafers on a turntable in a tank filled with abrasive slurry and turning an abrasive roller wound around the outer circumferential surface thereof with an abrasive pad of soft elastic material while facing the outer circumferential part of the semiconductor wafer. The apparatus for abrading a semiconductor wafer further comprises a mechanism for placing a stack of semiconductor wafers in the abrasive slurry tank while aligning the positions of the notched parts and turning an abrasive belt having cross-sectional shape identical to that of the notched part while facing the notched part. The abrasive pad and abrasive belt are made of a soft elastic material of 7(Hs)-40(Hs).

NAKANO TERUYUKI (JP)
KOZAWA YASUHIRO (JP)
TAMBO HITOSHI (JP)
NAKAHASHI MANABU (JP)

PCT/JP2001/006354

July 11, 2002

July 23, 2001

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ISHIIHYOKI KK (JP)
NAKANO TERUYUKI (JP)
KOZAWA YASUHIRO (JP)
TAMBO HITOSHI (JP)
NAKAHASHI MANABU (JP)

B24B9/00; B24B7/24; B24B9/06; B24B37/00; B24B37/20; B24B37/24; H01L21/304; (IPC1-7): H01L21/304

EP0940219A2	1999-09-08
JPH10277931A	1998-10-20
JPH07100737A	1995-04-18
JP2000082688A	2000-03-21
JPH11188610A	1999-07-13

Ehara, Syogo (Edobori 1-chome Nishi-ku Osaka-shi, Osaka, JP)

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