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Title:
APPARATUS AND METHOD FOR AUGMENTED COOLING OF COMPUTERS
Document Type and Number:
WIPO Patent Application WO2003052819
Kind Code:
A3
Abstract:
A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the computer's internal heat removal system and a heat transfer module connected to the thermal interface port. The heat transfer module has a heat dissipation component and at least one heat transfer conduit having one end thermally coupled to the computer's internal heat removal system, and the other end thermally coupled to the heat dissipation component.

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Inventors:
OTEY ROBERT (US)
RABE BRIAN (US)
Application Number:
PCT/US2002/040122
Publication Date:
November 27, 2003
Filing Date:
December 12, 2002
Export Citation:
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Assignee:
OTEY ROBERT (US)
RABE BRIAN (US)
International Classes:
F25B21/02; F25B25/00; F28D15/02; H01L23/38; H01L23/427; H01L35/30; F25B23/00; (IPC1-7): H01L23/38; G06F1/20; F25B21/02; F28D15/02
Foreign References:
US5974556A1999-10-26
US20010007525A12001-07-12
US6276448B12001-08-21
US5704212A1998-01-06
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