APPARATUS AND METHOD FOR DRY ETCHING

Title:

APPARATUS AND METHOD FOR DRY ETCHING

Document Type and Number:

WIPO Patent Application WO/2008/029854

Kind Code:

A1

Abstract:

This invention provides an apparatus and method for etching, which, in the dry etching of a workpiece having a large coefficient of thermal expansion, can eliminate a problem of cracking of the workpiece upon exposure to thermal deformation and thermal shock during etching. An electrode structure having a convexed surface is provided. The convex shape is one which is a circle concentric with the cross section of the electrode structure, and the height of the convex shape is 0.2 to 1.0 mm. A workpiece formed of a material having a coefficient of thermal expansion of not less than 30 × 10-7/°C is etched with the dry etching apparatus.

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Inventors:

MORIKAWA YASUHIRO (JP)
SUU KOUKOU (JP)

Application Number:

PCT/JP2007/067333

Publication Date:

March 13, 2008

Filing Date:

September 05, 2007

Export Citation:

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Assignee:

ULVAC INC (JP)
MORIKAWA YASUHIRO (JP)
SUU KOUKOU (JP)

International Classes:

H01L21/3065; C01B33/12; C03C15/00; H03H3/02; H03H3/08; H05H1/46

Foreign References:

JPH08316215A	1996-11-29
JP2002216945A	2002-08-02
JPH07263192A	1995-10-13
JP2002343775A	2002-11-29
JPH05315881A	1993-11-26

Other References: