Title:
APPARATUS AND METHOD FOR ELECTROPLATING A WAFER SURFACE
Document Type and Number:
WIPO Patent Application WO2003056609
Kind Code:
A3
Abstract:
The present invention provides for a method of electroplating a wafer surface comprising introducing a plating liquid to the wafer surface in a chamber and rotating the wafer about an axis of rotation passing through the surface to be plated, and including the further step of moving the wafer such that its axis of rotation is itself caused to rotate about a second axis of rotation.
Inventors:
DE KUBBER DAAN L (NL)
Application Number:
PCT/IB2002/005396
Publication Date:
March 10, 2005
Filing Date:
December 12, 2002
Export Citation:
Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
DE KUBBER DAAN L (NL)
DE KUBBER DAAN L (NL)
International Classes:
C25D5/00; C25D21/10; C25D7/12; H01L21/00; H01L21/288; C25D5/04; C25D17/06; (IPC1-7): C25D5/00; C25D7/12
Domestic Patent References:
| WO1997003230A1 | 1997-01-30 |
Foreign References:
| JP2001316890A | 2001-11-16 | |||
| US5670034A | 1997-09-23 |
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