Title:
APPARATUS AND METHOD FOR FORMING COMPOUND INTEGRATED CIRCUITS
Document Type and Number:
WIPO Patent Application WO2005043601
Kind Code:
A3
Abstract:
The present invention provides for modularized circuits (500) and methods of manufacturing both modularized circuits ("master modules") (520, 522, 524, 526) and compound Ics (504). These master modules are designed to minimize waste and to evenly distribute power throughout its structure. Also, a number of master modules (520, 522, 524, 526) and a compound IC (504) composed of a group of these master modules are structured to minimize the effects of mechanically-induced stresses. In one embodiment, a substrate includes master modules (520, 522, 524, 526) distributed over a surface of the substrate, wherein each master module includes, for example, one or more logic circuits, a memory, an input interface and an output interface.
Inventors:
BATEMAN STEPHEN CHARLES (US)
BAILEY DOUGLAS JOHN (US)
COAKLEY DAVID JOHN (US)
BAILEY DOUGLAS JOHN (US)
COAKLEY DAVID JOHN (US)
Application Number:
PCT/US2004/036739
Publication Date:
December 01, 2005
Filing Date:
November 03, 2004
Export Citation:
Assignee:
CHIPX INC (US)
BATEMAN STEPHEN CHARLES (US)
BAILEY DOUGLAS JOHN (US)
COAKLEY DAVID JOHN (US)
BATEMAN STEPHEN CHARLES (US)
BAILEY DOUGLAS JOHN (US)
COAKLEY DAVID JOHN (US)
International Classes:
G06F17/50; H01L; (IPC1-7): G06F17/50
Foreign References:
| US6480989B2 | 2002-11-12 | |||
| US6226779B1 | 2001-05-01 | |||
| US6564364B1 | 2003-05-13 | |||
| US6175952B1 | 2001-01-16 | |||
| US6604228B1 | 2003-08-05 |
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