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Patent Searching and Data


Title:
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/094568
Kind Code:
A1
Abstract:
This apparatus for manufacturing a semiconductor device comprises: a substrate holding part which holds a substrate; a processing liquid supply part which supplies a processing liquid to the substrate that is held by the substrate holding part; an electrolysis treatment part which is arranged so as to face the substrate holding part and performs an electrolysis treatment on the substrate that is held by the substrate holding part; and a terminal for applying a voltage to the substrate. The electrolysis treatment part comprises: a direct electrode which is in contact with the processing liquid that is supplied to the substrate, and which applies a voltage between itself and the substrate; and an indirect electrode which forms an electric field in the processing liquid that is supplied to the substrate.

Inventors:
HOSHINO, Tomohisa (1-1 Fukuhara, Koshi Cit, Kumamoto 16, 〒8611116, JP)
HAMADA, Masato (1-1 Fukuhara, Koshi Cit, Kumamoto 16, 〒8611116, JP)
Application Number:
JP2016/084655
Publication Date:
June 08, 2017
Filing Date:
November 22, 2016
Export Citation:
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Assignee:
TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
International Classes:
C25D5/00; C25D5/18; C25D7/12; C25D21/12; H01L21/288
Domestic Patent References:
WO2015104951A12015-07-16
Foreign References:
JP2010013680A2010-01-21
JP2003528219A2003-09-24
JP2000208627A2000-07-28
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (Hazuki International, Kakubari Building 1-20, Sumiyoshi-cho, Shinjuku-k, Tokyo 65, 〒1620065, JP)
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