APPARATUS AND METHOD FOR MEASURING PROPERTY OF CONTACT HEAT CONDUCTION MATERIAL

WIPO Patent Application WO/2011/059245

A3

According to at least one embodiment of the present invention, an apparatus and a method for measuring the property of a contact heat conduction material are provided. The method comprises the steps of: calculating a thermal current value flowing into the contact heat conduction material which is positioned between one end of a second heat flux bar and a heat sink coupled with one end of a first heat flux bar; calculating temperature on each of the upper and lower surfaces of the contact heat conduction material by considering the calculated thermal current value; and calculating thermal resistance of the contact heat conduction material by considering the calculated thermal current value and the calculated temperature. Thus, the invention is capable of exactly measuring the thermal resistance of the contact heat conduction material contacted with the heat sink.

LEE SUN KYU (KR)
KIM JUNG KYUN (KR)
WATARU NAKAYAMA (JP)

PCT/KR2010/007960

November 03, 2011

November 11, 2010

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KWANGJU INST SCI & TECH (KR)
LEE SUN KYU (KR)
KIM JUNG KYUN (KR)
WATARU NAKAYAMA (JP)

G01N25/18; G01N25/00

JPH077027A	1995-01-10
US20070047614A1	2007-03-01

J. K. KIM ET AL.: "Characterization of a thermal interface material with thinner heat spreader", JOURNAL OF KSPE 2008 AUTUMN CONFERENCE, 2008, pages 67 - 68
BONG-HUN KIM: "A Study on the Thermal Conductivity of Carbon-Nanotube Nanofluids", JOURNAL OF SAREK 2006 SUMMER CONFERENCE, 2006, pages 168 - 175

WOOIN, PATENT & LAW FIRM (Shinwon Building 648-15Yeoksam-dong, Gangnam-gu, Seoul 135-911, KR)

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