APPARATUS AND METHOD FOR MOLDING PRODUCT WITH PATTERN

Title:

APPARATUS AND METHOD FOR MOLDING PRODUCT WITH PATTERN

Document Type and Number:

WIPO Patent Application WO/1995/018003

Kind Code:

A1

Abstract:

A molding apparatus comprising an injection molding die (1) composed of a first die (A) and a second die (B); unrolling means (2) for unrolling a length of film (7) with patterns; film introducing means (3) for introducing between the first die (A) and the second die (B) the film (7) unrolled by the unrolling means (2); main clamp means (4) for pressing the film (7) against the surface of the first die (A); cutting means (5) for cutting the film (7), provided on the upstream side of the surface of the first die (A); and sub-clamp means (6) for clamping a cut end (70) of the film (7), provided on the downstream side of the surface of the first die (A). The film introducing means (3) has pinching means (30) for grasping the cut end (70) of the film (7) and drive means (31) for reciprocating the pinching means (30).

Inventors:

YAMAZAKI SEIICHI (JP)

Application Number:

PCT/JP1994/002247

Publication Date:

July 06, 1995

Filing Date:

December 27, 1994

Export Citation:

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Assignee:

NISSHA PRINTING (JP)
YAMAZAKI SEIICHI (JP)

International Classes:

B29C45/14; (IPC1-7): B29C45/16; B29C45/14

Foreign References:

JPH05301250A	1993-11-16
JPH06315950A	1994-11-15

Other References: