Title:
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC PARTS
Document Type and Number:
WIPO Patent Application WO/1998/052399
Kind Code:
A1
Abstract:
An apparatus for mounting electronic parts on a printed circuit board. Electronic parts to be mounted on a printed circuit board are loaded into a set of electronic parts mounting members according to the type of the electronic parts. The electronic parts mounting members are arranged in a mounting member supplying case. The set of electronic parts mounting members arranged and held in the case are inserted into and held in a mounting member holder that is capable of holding the set of electronic parts mounting members in such a manner as to correspond to an electronic parts mounting section of the printed circuit board. The mounting member holder is attached to an electronic parts mounter. The set of electronic parts is mounted on the printed circuit board at once by the mounter.
More Like This:
| JP7153835 | Component mounter |
Inventors:
SUGIYAMA OSAMU (JP)
Application Number:
PCT/JP1998/002164
Publication Date:
November 19, 1998
Filing Date:
May 15, 1998
Export Citation:
Assignee:
SONY CORP (JP)
SUGIYAMA OSAMU (JP)
SUGIYAMA OSAMU (JP)
International Classes:
H05K13/02; H05K13/04; (IPC1-7): H05K13/02
Foreign References:
| JPH07251331A | 1995-10-03 | |||
| JPH06166434A | 1994-06-14 |
Other References:
See also references of EP 0926942A4
Attorney, Agent or Firm:
Koike, Akira (6-4 Toranomon 2-chom, Minato-ku Tokyo, JP)
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