Title:
APPARATUS AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS USING ONE OR MORE POLISHING SURFACES
Document Type and Number:
WIPO Patent Application WO2004095516
Kind Code:
A3
Abstract:
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces (256), multiple wafer carriers (260) and at least one load-and-unload cup (282). The cup may be configured to move to and from the wafer carriers by pivoting, or by linear reciprocation,. The carriers may be configured to move to and from the cup by pivoting or linear reciprocation.
Inventors:
JEONG IN KWON (US)
Application Number:
PCT/US2004/012348
Publication Date:
December 22, 2005
Filing Date:
April 21, 2004
Export Citation:
Assignee:
JEONG IN KWON (US)
INOPLA INC (US)
INOPLA INC (US)
International Classes:
B24B37/34; B24B51/00; (IPC1-7): B24B49/00; B24B51/00
Foreign References:
| US5498199A | 1996-03-12 | |||
| US6227950B1 | 2001-05-08 | |||
| US6309279B1 | 2001-10-30 | |||
| US6435941B1 | 2002-08-20 | |||
| US6562184B2 | 2003-05-13 |
Other References:
See also references of EP 1626840A4
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