Title:
APPARATUS AND METHOD FOR POLISHING AND WASHING A SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2011/055960
Kind Code:
A2
Abstract:
The invention relates to a polishing apparatus including at least one polishing module. Each polishing module includes: at least one polishing surface; at least one polishing head; at least one wafer transfer station; and a transfer device for transferring the at least one polishing head between the at least one polishing surface and the at least one wafer transfer station. The polishing module may include sealing means for protecting the at least one polishing surface from external particles, and fluid-spraying devices. The washing apparatus may include two or more drying chambers for enabling high productivity.
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Inventors:
JEONG, In Kwon (102-202, Nokwoon Hanshin Apt. Jamwon-dong 60-7, Seocho-gu, Seoul 137-030, 137-030, KR)
Application Number:
KR2010/007675
Publication Date:
May 12, 2011
Filing Date:
November 02, 2010
Export Citation:
Assignee:
JEONG, In Kwon (102-202, Nokwoon Hanshin Apt. Jamwon-dong 60-7, Seocho-gu, Seoul 137-030, 137-030, KR)
International Classes:
H01L21/304; B24B37/04
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (1575-1, Seocho-dong Seocho-gu, Seoul 137-875, 137-875, KR)
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