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Patent Searching and Data


Title:
APPARATUS AND METHOD FOR POUCH MOLDING
Document Type and Number:
WIPO Patent Application WO/2023/121095
Kind Code:
A1
Abstract:
The present invention relates to an apparatus and method for pouch molding, which employ a specific step added to a conventional pouch molding process, to modify the shape of a pouch and thus secure a larger clearance than that of a conventional pouch, so that the present invention can increase the capacity while being advantageous in depth forming, and thus can improve the moldability of the pouch to thereby increase the depth and capacity of a pouch cup portion. The apparatus for pouch molding according to the present invention comprises: a die on which a die groove indented in the shape in which a pouch is molded is formed; and a punch disposed above the die groove, wherein the punch includes a body portion inserted into the die groove together with a pouch film disposed between the die and the punch, and pressing portions provided on opposite sides of the body portion to press the pouch film toward the inner surface of the die groove.

Inventors:
LEE CHUNG HEE (KR)
KIM BEOM SU (KR)
KIM YONG NAM (KR)
PARK DONG HYEUK (KR)
Application Number:
PCT/KR2022/020134
Publication Date:
June 29, 2023
Filing Date:
December 12, 2022
Export Citation:
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Assignee:
LG ENERGY SOLUTION LTD (KR)
International Classes:
B29C51/08; B29C43/36; B29C43/52; H01M50/105; B29L31/00
Foreign References:
KR20200061034A2020-06-02
KR20160122798A2016-10-24
JP2009291953A2009-12-17
KR20170124882A2017-11-13
KR20190061572A2019-06-05
KR20210183205A
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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