Title:
APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/061695
Kind Code:
A3
Abstract:
A method of processing a substrate (1) that displays out-gassing when placed in a vacuum comprises placing the substrate in a vacuum and performing an out-gassing treatment by heating the substrate (1) to a temperature T1 and removing gaseous contamination emitted from the substrate (1) until the out-gassing rate is determined by the diffusion of the substrate's con¬ tamination and thus essentially a steady state has been established. Afterwards, the temperature is lowered to a temperature T2 at which the diffusion rate of the substrate's contamination is lower than at T1. The substrate (1) is further processed at said temperature T2 until the substrate (1) has been covered with a film (16) comprising a metal.
Inventors:
RIETZLER WOLFGANG (AT)
SCHOLTE VAN MAST BART (CH)
SCHOLTE VAN MAST BART (CH)
Application Number:
PCT/IB2010/055226
Publication Date:
July 14, 2011
Filing Date:
November 17, 2010
Export Citation:
Assignee:
OC OERLIKON BALZERS AG (LI)
RIETZLER WOLFGANG (AT)
SCHOLTE VAN MAST BART (CH)
RIETZLER WOLFGANG (AT)
SCHOLTE VAN MAST BART (CH)
International Classes:
H01L23/14; H01L21/56; H01L23/31; H01L23/538
Domestic Patent References:
| WO2002002445A1 | 2002-01-10 |
Foreign References:
| US6908561B1 | 2005-06-21 | |||
| US20060042755A1 | 2006-03-02 | |||
| US20050106855A1 | 2005-05-19 |
Attorney, Agent or Firm:
VON KEYSERLINGK, Albert et al. (Karlstr. 35, München, DE)
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