Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
APPARATUS AND METHOD FOR DEHYDRATION/VOLUME REDUCTION SOLIDIFICATION OF ORGANIC MATERIAL, AND DIE FOR ORGANIC MATERIAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2008/056592
Kind Code:
A1
Abstract:
This invention provides an apparatus for efficient dehydration/volume reduction solidification of a water-containing organic waste. A heating zone (6) which is heated to a temperature above 100°C is formed at an area which is a part within a pressure vessel (2) and on the terminating end side of operation toward a pressure volume reduction direction (4) in a piston-shaped member (5). A drainage passage (9) is provided in the pressure vessel (2) in its nonheating zone (8). When a waste (3) is heated in a heating zone (6) while operating the piston-shaped member (5), the internal pressure is raised in the heating zone (6). In this case, high-temperature water of a temperature above 100°C and steam are produced while causing a temperature rise in boiling point of the water, resulting in further increased internal pressure of the heating zone (6). This causes high-temperature water and steam flow into the nonheating zone (8), and water present in this place, together with high-temperature water and steam, is discharged, while being heated, through the drainage passage (9). Upon contact with the air, the water is instantly vaporized due to a lowering in boiling point.

Inventors:
KOYAMA, Mamoru (12-5, Suga 2-chome, Tondabayashi-sh, Osaka 62, 5840062, JP)
Application Number:
JP2007/071291
Publication Date:
May 15, 2008
Filing Date:
November 01, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KOM CO., LTD (12-5, Suga 2-chome Tondabayashi-sh, Osaka 62, 5840062, JP)
株式会社KOM (〒62 大阪府富田林市須賀2丁目12-5 Osaka, 5840062, JP)
International Classes:
B09B3/00; C02F11/12; F26B5/14; C10L5/00
Attorney, Agent or Firm:
KOSHIBA, Masaaki (Koshiba Patent Office, Nisshin Building14-22, Shitennoji 1-chome,Tennoji-ku, Osaka-sh, Osaka 51, 5430051, JP)
Download PDF: