Title:
APPARATUS FOR MOUNTING ELECTRONIC PARTS
Document Type and Number:
WIPO Patent Application WO/1984/002052
Kind Code:
A1
Abstract:
An apparatus for mounting electronic parts onto a printed circuit board includes a coating head (2) which applies a bonding agent or solder paste to a printed circuit board (5), and a mounting head (3) which removes electronic parts (a, b, c...) from a parts supply section (1), controls the positions of the removed electronic parts (a, b, c...), and then mounts them on the printed circuit board (5). Both heads (2), (3) are integrally provided on a head section (4) which moves relative to the printed circuit board (5). It is thereby possible to integrally conduct the application of the bonding agent and the mounting of the electronic parts (a, b, c...) by a single positioning motion of the head section (4).
Inventors:
SENO MAKITO (JP)
SAKURAI YOSHIKATSU (JP)
MISAWA YOSHIHIKO (JP)
MAEDA YOSHINOBU (JP)
SAKURAI YOSHIKATSU (JP)
MISAWA YOSHIHIKO (JP)
MAEDA YOSHINOBU (JP)
Application Number:
PCT/JP1983/000399
Publication Date:
May 24, 1984
Filing Date:
November 10, 1983
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Foreign References:
| GB2025804A | 1980-01-30 |
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