Title:
APPARATUS FOR POLISHING PLATE-LIKE BODY AND METHOD FOR POLISHING PLATE-LIKE BODY
Document Type and Number:
WIPO Patent Application WO/2014/013887
Kind Code:
A1
Abstract:
The present invention relates to an apparatus for polishing a plate-like body, which is provided with: a suction sheet that sucks and holds a plate-like body; a film body to which the suction sheet is attached; a carrier to which the film body is attached; and a polishing pad. This apparatus for polishing a plate-like body polishes the plate-like body by supplying a pressurized fluid between the film body and the carrier and thereby pressing the plate-like body, which is sucked and held by the suction sheet, against the polishing pad by means of the pressure of the pressurized fluid. An intermediate sheet, which has a rigidity in the tensile direction higher than the rigidity of the suction sheet in the tensile direction, is interposed between the film body and the suction sheet. An elastic sheet, which deforms following to the deformation of the film body in the sliding direction and in the pressurized direction, is interposed between the intermediate sheet and the film body.
Inventors:
KIMURA HIROSHI (JP)
FURUTA MITSURU (JP)
FURUTA MITSURU (JP)
Application Number:
PCT/JP2013/068433
Publication Date:
January 23, 2014
Filing Date:
July 04, 2013
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B24B37/30; B24B7/24; B24B41/06; H01L21/304
Domestic Patent References:
| WO2007020859A1 | 2007-02-22 |
Foreign References:
| JP2000167762A | 2000-06-20 | |||
| JP2000015572A | 2000-01-18 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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