Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
APPARATUS AND PROCESS FOR CUTTING ADHESIVE LABELS
Document Type and Number:
WIPO Patent Application WO/2010/009102
Kind Code:
A3
Abstract:
A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.

Inventors:
GREEN ALAN (US)
BENOIT DENNIS RENE (US)
Application Number:
PCT/US2009/050508
Publication Date:
April 01, 2010
Filing Date:
July 14, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AVERY DENNISON CORP (US)
GREEN ALAN (US)
BENOIT DENNIS RENE (US)
International Classes:
B26D7/10; B26F1/38; B31D1/02
Domestic Patent References:
WO2002014069A12002-02-21
Foreign References:
US3574026A1971-04-06
JP2004010203A2004-01-15
JP2008150144A2008-07-03
EP1837170A12007-09-26
US20040161573A12004-08-19
US20030089452A12003-05-15
GB865165A1961-04-12
US5515757A1996-05-14
EP1798011A12007-06-20
Attorney, Agent or Firm:
BEMBENICK, Brian, G. et al. (8080 Norton Parkway 22-, Mentor OH, US)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: OPTICAL FIBER COUPLER ARRAY

Next Patent: CONTROL OF MUCUS MEMBRANE BLEEDING WITH COLD PLASMA